LCMXO2-4000ZE-2BG256I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LFBGA |
|---|---|
| Quantity | 148 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000ZE-2BG256I – MachXO2 FPGA, 4320 logic elements, 256-LFBGA
The LCMXO2-4000ZE-2BG256I is a MachXO2 family Field Programmable Gate Array (FPGA) in a 256-ball LFBGA package offering 4320 logic elements, 206 I/Os and approximately 94 kbits of on-chip RAM. Built for industrial operating ranges and low-voltage operation, it targets designs that require flexible programmable logic, high I/O density, and non-volatile instant-on capability.
As part of the MachXO2 family, the device combines a flexible logic architecture with low-power operation and family-level features such as on-chip user flash memory, programmable I/Os and advanced clocking resources to support system-level glue logic, I/O expansion and interface bridging.
Key Features
- Core Logic: 4320 logic elements for implementing glue logic, state machines and mid-density combinational/sequential functions consistent with MachXO2 family architecture.
- On-chip Memory: Total RAM bits: 94,208 (approximately 94 kbits) of embedded memory for buffering and small data stores.
- I/O Density and Flexibility: 206 user I/Os with programmable sysIO™ buffer support for a wide range of interfaces as provided by MachXO2 family I/O standards.
- Low-Voltage Operation & Power: Supports supply voltage range 1.14 V to 1.26 V and family-level low-power features, enabling lower system power consumption and standby modes.
- Non-volatile Configuration & Reconfiguration: MachXO2 family features include instant-on non-volatile configuration, in-field reconfiguration and background programming via standard interfaces.
- Clocking and PLLs: Family-level support for multiple primary clocks and analog PLLs provides flexible clock management for synchronous interfaces.
- Package, Mounting & Temperature: 256-LFBGA (supplier package: 256-CABGA 14×14), surface-mount mounting, industrial-grade operation from −40 °C to 100 °C.
- Standards and Compliance: RoHS compliant; supports IEEE-1149.1 boundary scan and IEEE-1532 in-system programming at the family level.
Typical Applications
- Display and Video Interface Support: Use pre-engineered source-synchronous I/O and display gearing available in the MachXO2 family to implement display bridging and timing logic.
- Memory Interface and Buffering: Leverage the device’s high I/O count and embedded RAM for DDR/DDR2/LPDDR interface support and data buffering where pre-engineered memory support is required.
- Peripheral and Bus Bridging: Hardened family-level peripherals such as SPI and I²C combined with flexible I/O make this device suitable for bridging sensors, peripherals and local buses.
- Industrial Control and Glue Logic: Industrial temperature rating, instant-on configuration and mid-range logic density suit system control, FPGA-based glue logic and sequencing in industrial equipment.
Unique Advantages
- High I/O Count: 206 I/Os enable dense connectivity to peripherals, memory and external interfaces without additional I/O expanders.
- Balanced Logic and Memory: 4320 logic elements paired with ~94 kbits of embedded RAM provide a balanced resource set for mid-density logic and buffering requirements.
- Low-Voltage, Low-Power Operation: Operates from 1.14 V to 1.26 V and benefits from MachXO2 family low-power modes to help reduce system power consumption.
- Industrial Temperature Range: Specified for −40 °C to 100 °C operation for deployment in industrial environments.
- Non-volatile Instant-On: Family-level instant-on and in-field reconfiguration reduce boot time and enable safe updates without external volatile configuration memory.
- Compact, Surface-Mount Package: 256-LFBGA (14 mm × 14 mm cabga footprint) provides a high-density solution in a compact form factor for space-constrained boards.
Why Choose LCMXO2-4000ZE-2BG256I?
The LCMXO2-4000ZE-2BG256I delivers a practical combination of mid-range logic density, substantial I/O capacity and embedded RAM in a low-voltage, industrial-temperature rated FPGA. It is suited to engineers who need a compact, non-volatile programmable device for system glue logic, interface bridging, and control functions where instant-on behavior and reconfigurability are important.
Backed by MachXO2 family-level features such as programmable sysIO, flexible clocking and family support for on-chip user flash and in-system programming, this device provides a scalable platform for designs that require long-term robustness and access to the broader MachXO2 ecosystem.
Request a quote or submit a purchase inquiry to receive pricing, lead time and availability for the LCMXO2-4000ZE-2BG256I. Our team can provide the next steps to integrate this MachXO2 device into your design.