LCMXO2-4000ZE-1TG144C

The LCMXO2-4000ZE-1TG144C is a MachXO2 series Field Programmable Gate Array (FPGA) in a 144-pin LQFP package, offered as a commercial-grade, surface-mount device. This device delivers 4,320 logic elements with approximately 94,208 bits of on-chip RAM and 114 I/O pins, making it suitable for board-level glue logic, interface bridging and user I/O expansion in embedded systems.

As a member of the MachXO2 family, the device benefits from the family’s flexible logic architecture, low-power design features and on-chip non-volatile configuration options described in the MachXO2 family datasheet.

Key Features

• Logic Core — This device provides 4,320 logic elements, implementing combinational and sequential logic for glue logic, control and protocol handling.
• On-Chip Memory — Approximately 94,208 bits of total on-chip RAM are available for FIFOs, buffers and small data storage needs.
• I/O and Interface Flexibility — 114 I/O pins in the 144-LQFP package enable extensive connectivity; the MachXO2 family supports programmable sysIO buffer standards and a wide range of interface options.
• Power — Single-supply operation with a specified voltage range of 1.14 V to 1.26 V for this device; the MachXO2 family includes low-power process optimizations and standby modes.
• Configuration and Reconfiguration (Family) — MachXO2 family devices support non-volatile on-chip user Flash memory, instant-on behavior and multiple programming interfaces such as JTAG, SPI and I2C as described in the family datasheet.
• Clocking and Timing (Family) — The MachXO2 family provides flexible on-chip clock resources, including multiple primary clocks and fractional-N PLLs as documented in the family datasheet.
• Package and Mounting — Surface-mount 144-LQFP package (supplier device package: 144-TQFP, 20 × 20 mm) for compact board-level integration.
• Operating Conditions — Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• Interface Bridging — Use the device’s flexible I/O and plentiful I/O count to bridge between legacy and modern interfaces on a single board.
• Board-Level Glue Logic — Implement custom control, timing and protocol translation logic using the 4,320 logic elements and on-chip RAM for buffering.
• Display and High-Speed I/O Control — Leverage MachXO2 family I/O features and dedicated gearing for display or source-synchronous interfaces where supported by the family.
• In-Field Logic Updates — Take advantage of family-level reconfiguration capabilities for firmware updates and feature upgrades without replacing hardware.

Unique Advantages

• Right-sized Logic Density: 4,320 logic elements provide a balance of capacity and cost for mid-density glue-logic and control applications.
• Generous I/O Count: 114 I/Os in a 144-LQFP footprint simplify board routing and reduce the need for external bus extenders or multiplexers.
• Integrated Memory Resources: Approximately 94 kbits of on-chip RAM enable local buffering and data handling without additional SRAM devices.
• Low-voltage Operation: The specified supply range of 1.14 V to 1.26 V supports designs targeting low-voltage system rails.
• Commercial-Grade Reliability: Designed for 0 °C to 85 °C operation with RoHS-compliant packaging for mainstream embedded applications.
• Family Ecosystem: Access to MachXO2 family features such as non-volatile configuration options, programmable interfaces and power-saving modes supports system-level flexibility.

Why Choose LCMXO2-4000ZE-1TG144C?

The LCMXO2-4000ZE-1TG144C combines a mid-range logic capacity with a high I/O count and substantial on-chip RAM in a compact 144-LQFP package, making it well suited for embedded designers needing board-level glue logic, interface bridging and configurable I/O. Its commercial-grade temperature range and RoHS compliance simplify integration into mainstream consumer and industrial-adjacent products.

As part of the MachXO2 family, this device benefits from family-level features such as flexible clocking, on-chip non-volatile configuration and low-power options, providing a scalable platform for designs that may evolve through in-field updates or density migration within the family.

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