LCMXO2-4000ZE-1TG144I

The LCMXO2-4000ZE-1TG144I is a MachXO2 family Field Programmable Gate Array (FPGA) in a 144-LQFP package designed for industrial-grade embedded control and I/O management. It combines a flexible logic architecture with on-chip nonvolatile flash and a broad set of programmable I/O features to support system glue logic, interface bridging, and in-field updates.

With 4,320 logic elements, approximately 94,208 bits of on-chip RAM and 114 I/Os, this device targets designs that require moderate logic density, diverse I/O standards, low standby power, and extended operating temperature range.

Key Features

• Core Logic — 4,320 logic elements provide flexible LUT-based logic resources suitable for glue logic, control finite-state machines, and small to mid-scale programmable functions.
• Embedded and Distributed Memory — Approximately 94,208 bits of on-chip RAM plus family-level support for embedded block RAM and distributed RAM enable FIFOs, small buffers and state storage.
• On-Chip Nonvolatile Memory — Family support for up to 256 kbits of user flash memory enables instant-on operation and in-field configuration storage for background programming and dual-boot options.
• I/O and Interface Flexibility — 114 programmable I/Os with sysIO buffer support for multiple standards and on-chip differential termination; family features include programmable low-swing differential I/Os and DDR-capable I/O cells for source-synchronous interfaces.
• Clocking and PLLs — Family-level support for up to two analog PLLs with fractional-N synthesis and multiple primary clock domains supports a range of clocking and gear ratios for high-speed interfaces.
• Low-Power Operation — Family features include ultra low standby power modes and programmable power-saving options to minimize system idle energy draw.
• System-Level Integration — On-chip peripherals documented at the family level include SPI, I2C, timer/counter, an on-chip oscillator and IEEE 1149.1 boundary scan; features support background programming and secure single-chip configuration.
• Industrial Grade and Robust Supply — Industrial operating temperature range of −40 °C to 100 °C and a documented supply voltage range of 1.14 V to 1.26 V for the device.
• Package and Mounting — Surface-mount 144-LQFP (20 × 20 mm) package for compact board-level integration and RoHS-compliant packaging.

Typical Applications

• System Control and Glue Logic — Implement bus bridging, protocol adaptation, and board-level control functions using the device’s logic elements, on-chip flash and programmable I/Os.
• Display and Memory Interface — Use source-synchronous I/O, DDR-capable I/O cells and gearing logic to implement display drivers and memory interface glue with dedicated DDR support.
• Boot and In-Field Update Management — Store boot images in on-chip user flash and leverage TransFR™ reconfiguration for in-field logic updates while the system operates.
• Low-Power Embedded Systems — Take advantage of ultra low standby power modes for designs that need low idle power and fast wake-up (instant-on) behavior.

Unique Advantages

• Integrated Nonvolatile Configuration: On-chip user flash enables instant-on behavior and background programming without external configuration memory.
• Broad I/O Versatility: 114 programmable I/Os with support for multiple standards and on-chip differential termination simplifies interfacing to a wide range of peripherals.
• Industrial Temperature Range: Operation from −40 °C to 100 °C supports deployment in industrial environments requiring extended thermal tolerance.
• Compact, Surface-Mount Package: The 144-LQFP package offers a compact footprint for space-constrained applications while providing substantial I/O count.
• In-Field Reconfiguration: Family-level TransFR reconfiguration and dual-boot options enable safe in-field logic updates and flexible deployment strategies.
• Standby Power Efficiency: Documented low-power modes reduce system standby consumption, helping designs meet stringent energy budgets.

Why Choose LCMXO2-4000ZE-1TG144I?

The LCMXO2-4000ZE-1TG144I positions itself as a balanced solution for designers needing moderate logic density, extensive I/O flexibility and on-chip nonvolatile configuration in an industrial-grade package. Its combination of 4,320 logic elements, substantial on-chip RAM, on-chip flash and family-level peripherals enables compact, integrated designs with support for in-field updates and low-power operation.

This device is well suited for embedded systems engineers and procurement teams looking for a reconfigurable, instant-on FPGA that simplifies board-level integration, supports multiple interface standards and provides the environmental range required for industrial deployments.

Request a quote or submit a procurement inquiry to get pricing and availability for the LCMXO2-4000ZE-1TG144I.