LCMXO2-4000ZE-2BG256C

IC FPGA 206 I/O 256CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LFBGA

Quantity 1,778 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000ZE-2BG256C – MachXO2 FPGA, 256-LFBGA

The LCMXO2-4000ZE-2BG256C is a MachXO2 field-programmable gate array (FPGA) IC from Lattice Semiconductor, delivered in a 256-ball LFBGA package. It combines moderate logic density with extensive I/O and on-chip non-volatile memory to support system control, interface bridging, and in-field logic updates.

With 4,320 logic elements, 206 user I/Os and approximately 94 kbits of on-chip RAM, this commercial-grade device targets applications that need flexible I/O, low-power standby operation, and non-volatile configuration in a compact surface-mount package.

Key Features

  • Core Logic — 4,320 logic elements provide programmable logic capacity for glue logic, state machines, and custom control functions.
  • Memory — Approximately 94 kbits (94,208 bits) of on-chip RAM for distributed and embedded memory needs; MachXO2-4000 devices include user flash memory (UFM) capability as described in the MachXO2 family data.
  • User Flash & Reconfiguration — On-chip user flash memory with series-level support for background programming and TransFR in-field reconfiguration for logic updates while the system operates.
  • I/O Capacity & Flexibility — 206 I/Os in the 256-LFBGA package; the MachXO2 family provides programmable sysIO buffer support and a wide range of I/O standards at the device-family level.
  • Clocking & PLLs — Family-level support for up to two PLLs and multiple primary clocks for flexible clock management on high-speed interfaces.
  • Low-Voltage Operation — Core supply range from 1.14 V to 1.26 V for low-power system designs.
  • Low-Power Options — MachXO2 family includes ultra-low power modes and features such as microsecond instant-on and very low standby power (series-level information).
  • Package & Mounting — Surface-mount 256-LFBGA package (supplier device package noted as 256-CABGA, 14 × 14 mm) for compact board implementations.
  • Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C.
  • On-chip System Features — Family-level hardened peripherals including SPI, I²C and timer/counter, plus on-chip oscillator and IEEE boundary-scan/in-system programming support.
  • RoHS Compliant — Manufactured in compliance with RoHS environmental requirements.

Typical Applications

  • Interface Bridging and Glue Logic — Use the device’s 206 I/Os and programmable logic to implement protocol translation, bus bridging and glue logic between components.
  • System Control and Configuration — Leverage on-chip user flash memory and hardened I²C/SPI peripherals for boot configuration, device management and control functions.
  • In-field Reconfigurable Systems — Take advantage of TransFR reconfiguration to update logic in the field without taking the entire system offline.
  • Memory and Display Interfaces — Use family-level DDR/DDR2 and display gearing support along with flexible I/O standards for memory and display interface implementations.

Unique Advantages

  • Balanced Logic Density and I/O Count: 4,320 logic elements combined with 206 I/Os provide a practical balance for mid-density designs that require substantial peripheral connectivity.
  • Non-volatile, Reconfigurable Storage: On-chip user flash memory and background programming enable secure, single-chip configuration and field updates.
  • Compact, Surface-Mount Packaging: The 256-ball LFBGA/caBGA package options enable a small footprint implementation while delivering high I/O.
  • Low-Voltage Core: Narrow core supply range (1.14 V–1.26 V) supports low-power system architectures.
  • System-Level Integration: Hardened SPI, I²C and timer/counter functions reduce external component count and simplify board design at the system level.
  • Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.

Why Choose LCMXO2-4000ZE-2BG256C?

The LCMXO2-4000ZE-2BG256C positions itself as a versatile mid-density MachXO2 FPGA offering a strong combination of logic capacity, large I/O count and non-volatile configuration in a compact, surface-mount package. Its family-provided features—such as on-chip flash, reconfiguration capabilities and hardened peripherals—enable integration of control, interface and update functions while reducing external BOM.

This device is well suited to designers seeking a commercial-grade, reconfigurable solution for system control, interface bridging, and in-field updates where compact packaging and low-voltage operation are important considerations. Series-level features and industry-standard programming interfaces support long-term scalability and maintainability within the MachXO2 ecosystem.

Request a quote or submit a procurement inquiry today to check availability and pricing for the LCMXO2-4000ZE-2BG256C.

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