LCMXO2-4000ZE-2BG256C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LFBGA |
|---|---|
| Quantity | 1,778 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000ZE-2BG256C – MachXO2 FPGA, 256-LFBGA
The LCMXO2-4000ZE-2BG256C is a MachXO2 field-programmable gate array (FPGA) IC from Lattice Semiconductor, delivered in a 256-ball LFBGA package. It combines moderate logic density with extensive I/O and on-chip non-volatile memory to support system control, interface bridging, and in-field logic updates.
With 4,320 logic elements, 206 user I/Os and approximately 94 kbits of on-chip RAM, this commercial-grade device targets applications that need flexible I/O, low-power standby operation, and non-volatile configuration in a compact surface-mount package.
Key Features
- Core Logic — 4,320 logic elements provide programmable logic capacity for glue logic, state machines, and custom control functions.
- Memory — Approximately 94 kbits (94,208 bits) of on-chip RAM for distributed and embedded memory needs; MachXO2-4000 devices include user flash memory (UFM) capability as described in the MachXO2 family data.
- User Flash & Reconfiguration — On-chip user flash memory with series-level support for background programming and TransFR in-field reconfiguration for logic updates while the system operates.
- I/O Capacity & Flexibility — 206 I/Os in the 256-LFBGA package; the MachXO2 family provides programmable sysIO buffer support and a wide range of I/O standards at the device-family level.
- Clocking & PLLs — Family-level support for up to two PLLs and multiple primary clocks for flexible clock management on high-speed interfaces.
- Low-Voltage Operation — Core supply range from 1.14 V to 1.26 V for low-power system designs.
- Low-Power Options — MachXO2 family includes ultra-low power modes and features such as microsecond instant-on and very low standby power (series-level information).
- Package & Mounting — Surface-mount 256-LFBGA package (supplier device package noted as 256-CABGA, 14 × 14 mm) for compact board implementations.
- Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C.
- On-chip System Features — Family-level hardened peripherals including SPI, I²C and timer/counter, plus on-chip oscillator and IEEE boundary-scan/in-system programming support.
- RoHS Compliant — Manufactured in compliance with RoHS environmental requirements.
Typical Applications
- Interface Bridging and Glue Logic — Use the device’s 206 I/Os and programmable logic to implement protocol translation, bus bridging and glue logic between components.
- System Control and Configuration — Leverage on-chip user flash memory and hardened I²C/SPI peripherals for boot configuration, device management and control functions.
- In-field Reconfigurable Systems — Take advantage of TransFR reconfiguration to update logic in the field without taking the entire system offline.
- Memory and Display Interfaces — Use family-level DDR/DDR2 and display gearing support along with flexible I/O standards for memory and display interface implementations.
Unique Advantages
- Balanced Logic Density and I/O Count: 4,320 logic elements combined with 206 I/Os provide a practical balance for mid-density designs that require substantial peripheral connectivity.
- Non-volatile, Reconfigurable Storage: On-chip user flash memory and background programming enable secure, single-chip configuration and field updates.
- Compact, Surface-Mount Packaging: The 256-ball LFBGA/caBGA package options enable a small footprint implementation while delivering high I/O.
- Low-Voltage Core: Narrow core supply range (1.14 V–1.26 V) supports low-power system architectures.
- System-Level Integration: Hardened SPI, I²C and timer/counter functions reduce external component count and simplify board design at the system level.
- Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.
Why Choose LCMXO2-4000ZE-2BG256C?
The LCMXO2-4000ZE-2BG256C positions itself as a versatile mid-density MachXO2 FPGA offering a strong combination of logic capacity, large I/O count and non-volatile configuration in a compact, surface-mount package. Its family-provided features—such as on-chip flash, reconfiguration capabilities and hardened peripherals—enable integration of control, interface and update functions while reducing external BOM.
This device is well suited to designers seeking a commercial-grade, reconfigurable solution for system control, interface bridging, and in-field updates where compact packaging and low-voltage operation are important considerations. Series-level features and industry-standard programming interfaces support long-term scalability and maintainability within the MachXO2 ecosystem.
Request a quote or submit a procurement inquiry today to check availability and pricing for the LCMXO2-4000ZE-2BG256C.

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