LFE2-20E-5F256I

The LFE2-20E-5F256I is an ECP2 family FPGA IC from Lattice Semiconductor Corporation featuring approximately 21,000 logic elements and 2,625 configurable logic blocks (CLBs). It integrates roughly 0.283 Mbits of embedded RAM and provides 193 user I/O pins in a compact 256‑ball FBGA package (17×17 mm).

Designed for industrial-grade operation, the device supports a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C. It is supplied as a surface-mount device and is RoHS compliant.

Key Features

• FPGA Core  ECP2 family FPGA architecture with approximately 21,000 logic elements for implementing custom digital logic and control functions.
• Configurable Logic Blocks  2,625 configurable logic blocks (CLBs) to partition and organize logic resources across designs.
• On‑Chip Memory  Approximately 0.283 Mbits of embedded RAM for buffering, state storage, and local data processing.
• I/O Capacity  193 user I/O pins to support a wide range of external interfaces and signal connectivity.
• Power  Operates from a core supply voltage of 1.14 V to 1.26 V, matching low-voltage system domains.
• Package & Mounting  256‑ball FBGA package (256‑BGA), supplier package specified as 256‑FPBGA (17×17), delivered as a surface-mount component.
• Temperature & Grade  Industrial-grade device rated for −40 °C to 100 °C operating temperature.
• Environmental Compliance  RoHS compliant.

Unique Advantages

• Substantial logic capacity: Approximately 21,000 logic elements provide headroom for mid-range logic integration and custom IP implementation.
• Generous I/O count: 193 user I/Os enable multi-interface designs and flexible external connectivity without immediate need for additional bridging components.
• Integrated on‑chip RAM: Around 0.283 Mbits of embedded memory reduces dependency on external RAM for moderate buffering and local data storage.
• Industrial temperature support: −40 °C to 100 °C rating suits applications that require extended ambient operating conditions.
• Compact BGA package: 256‑ball FBGA in a 17×17 mm footprint supports dense board layouts while keeping the device surface-mount friendly.
• Regulatory readiness: RoHS compliance assists in meeting environmental directives for shipped assemblies.

Why Choose LFE2-20E-5F256I?

The LFE2-20E-5F256I balances substantial logic resources, a high I/O count, and embedded memory in a compact 256‑BGA package, making it suitable for industrial designs that require mid-range programmable logic and robust operating temperature support. Its 1.14 V to 1.26 V core supply range and surface-mount package align with modern board-level power and assembly practices.

Choose this Lattice Semiconductor FPGA when you need a verified set of hardware specifications—logic capacity, I/O density, on-chip RAM, industrial temperature rating, and RoHS compliance—packaged for space-efficient PCB designs.

Request a quote or submit an inquiry for LFE2-20E-5F256I to get pricing and availability information and to discuss how this FPGA can fit your design requirements.