LFE2-20E-5F484I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 331 282624 21000 484-BBGA |
|---|---|
| Quantity | 669 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 331 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2625 | Number of Logic Elements/Cells | 21000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFE2-20E-5F484I – ECP2 Field Programmable Gate Array (FPGA) IC 331 282624 21000 484-BBGA
The LFE2-20E-5F484I is a field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation designed for applications requiring a balance of logic capacity, I/O density, and industrial-grade operation. It provides 21,000 logic elements, approximately 0.28 Mbits of embedded memory, and 331 I/O pins in a 484-ball BGA package.
With a 1.14–1.26 V core supply range, surface-mount 484-ball package, and an operating temperature range of −40 °C to 100 °C, this device targets industrial applications that demand robust temperature performance and significant on-chip logic and memory resources.
Key Features
- Programmable Logic Capacity 21,000 logic elements provide mid-range programmable logic resources for custom digital designs.
- Embedded Memory Approximately 0.28 Mbits of on-chip RAM to support buffering, state storage, and small lookup tables.
- I/O Density 331 user I/O pins to accommodate multiple interfaces, sensors, and peripheral connections.
- Power Supply Core voltage range of 1.14 V to 1.26 V for defined power requirements and system planning.
- Industrial Temperature Range Rated for −40 °C to 100 °C operation, suitable for industrial environments and extended-temperature deployments.
- Package and Mounting 484-ball BGA (supplier package: 484-FPBGA, 23×23) in a surface-mount package for compact board integration.
- Compliance RoHS compliant, meeting common environmental and lead-free manufacturing requirements.
Typical Applications
- Industrial Control Deploy logic for motor control, PLC interfacing, and real-time I/O aggregation using the device’s industrial temperature rating and 331 I/O pins.
- Communications and Networking Implement custom packet processing, protocol bridging, or I/O buffering leveraging the on-chip memory and programmable logic.
- Embedded System Integration Integrate peripheral glue logic, signal conditioning, and custom interfaces where moderate logic density and plentiful I/O are required.
Unique Advantages
- Balanced Logic and Memory: 21,000 logic elements combined with approximately 0.28 Mbits of RAM provide a practical balance for mid-range FPGA tasks without overprovisioning.
- High I/O Count: 331 I/O pins enable direct connection to numerous sensors, peripherals, and buses, reducing the need for external multiplexing.
- Industrial Reliability: Rated operation from −40 °C to 100 °C supports deployment in industrial and extended-temperature environments.
- Compact Surface-Mount Packaging: 484-ball BGA (23×23) package offers a high-density footprint for space-constrained boards while maintaining robust soldered connections.
- Predictable Power Envelope: The defined 1.14–1.26 V supply range simplifies power delivery design and system-level budgeting.
- Environmental Compliance: RoHS compliance assists with regulatory and manufacturing requirements for lead-free production.
Why Choose LFE2-20E-5F484I?
The LFE2-20E-5F484I is positioned for engineers who need a mid-range FPGA with substantial I/O and reliable operation across industrial temperatures. Its combination of 21,000 logic elements, approximately 0.28 Mbits of embedded memory, and 331 I/O pins makes it a practical choice for industrial control, communications, and embedded integration projects that require programmable logic in a compact BGA package.
Choose this device when your design demands a balance of logic capacity, generous I/O, RoHS compliance, and operation from −40 °C to 100 °C within a surface-mount 484-ball package.
Request a quote or submit an inquiry to receive pricing and availability for the LFE2-20E-5F484I.

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