LFE2-20E-5F484I

IC FPGA 331 I/O 484FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 331 282624 21000 484-BBGA

Quantity 669 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O331Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2625Number of Logic Elements/Cells21000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFE2-20E-5F484I – ECP2 Field Programmable Gate Array (FPGA) IC 331 282624 21000 484-BBGA

The LFE2-20E-5F484I is a field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation designed for applications requiring a balance of logic capacity, I/O density, and industrial-grade operation. It provides 21,000 logic elements, approximately 0.28 Mbits of embedded memory, and 331 I/O pins in a 484-ball BGA package.

With a 1.14–1.26 V core supply range, surface-mount 484-ball package, and an operating temperature range of −40 °C to 100 °C, this device targets industrial applications that demand robust temperature performance and significant on-chip logic and memory resources.

Key Features

  • Programmable Logic Capacity  21,000 logic elements provide mid-range programmable logic resources for custom digital designs.
  • Embedded Memory  Approximately 0.28 Mbits of on-chip RAM to support buffering, state storage, and small lookup tables.
  • I/O Density  331 user I/O pins to accommodate multiple interfaces, sensors, and peripheral connections.
  • Power Supply  Core voltage range of 1.14 V to 1.26 V for defined power requirements and system planning.
  • Industrial Temperature Range  Rated for −40 °C to 100 °C operation, suitable for industrial environments and extended-temperature deployments.
  • Package and Mounting  484-ball BGA (supplier package: 484-FPBGA, 23×23) in a surface-mount package for compact board integration.
  • Compliance  RoHS compliant, meeting common environmental and lead-free manufacturing requirements.

Typical Applications

  • Industrial Control  Deploy logic for motor control, PLC interfacing, and real-time I/O aggregation using the device’s industrial temperature rating and 331 I/O pins.
  • Communications and Networking  Implement custom packet processing, protocol bridging, or I/O buffering leveraging the on-chip memory and programmable logic.
  • Embedded System Integration  Integrate peripheral glue logic, signal conditioning, and custom interfaces where moderate logic density and plentiful I/O are required.

Unique Advantages

  • Balanced Logic and Memory:  21,000 logic elements combined with approximately 0.28 Mbits of RAM provide a practical balance for mid-range FPGA tasks without overprovisioning.
  • High I/O Count:  331 I/O pins enable direct connection to numerous sensors, peripherals, and buses, reducing the need for external multiplexing.
  • Industrial Reliability:  Rated operation from −40 °C to 100 °C supports deployment in industrial and extended-temperature environments.
  • Compact Surface-Mount Packaging:  484-ball BGA (23×23) package offers a high-density footprint for space-constrained boards while maintaining robust soldered connections.
  • Predictable Power Envelope:  The defined 1.14–1.26 V supply range simplifies power delivery design and system-level budgeting.
  • Environmental Compliance:  RoHS compliance assists with regulatory and manufacturing requirements for lead-free production.

Why Choose LFE2-20E-5F484I?

The LFE2-20E-5F484I is positioned for engineers who need a mid-range FPGA with substantial I/O and reliable operation across industrial temperatures. Its combination of 21,000 logic elements, approximately 0.28 Mbits of embedded memory, and 331 I/O pins makes it a practical choice for industrial control, communications, and embedded integration projects that require programmable logic in a compact BGA package.

Choose this device when your design demands a balance of logic capacity, generous I/O, RoHS compliance, and operation from −40 °C to 100 °C within a surface-mount 484-ball package.

Request a quote or submit an inquiry to receive pricing and availability for the LFE2-20E-5F484I.

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