LFE2-20E-5FN256C

The LFE2-20E-5FN256C is a commercial-grade Field Programmable Gate Array (FPGA) provided in a 256-pin BGA package. It delivers a mid-range logic capacity with configurable I/O and on-chip memory to support reconfigurable digital logic in commercial embedded systems.

Designed for surface-mount applications, this device combines up to 21,000 logic elements, 193 I/O pins, and approximately 0.283 Mbits of embedded memory while operating from a 1.14 V to 1.26 V supply and across a 0 °C to 85 °C temperature range.

Key Features

• Core Logic  Provides 21,000 logic elements to implement custom digital logic and finite-state machines for commercial designs.
• Embedded Memory  Includes approximately 0.283 Mbits of on-chip RAM to support data buffering, state storage, and small lookup tables.
• I/O Density  193 user I/O pins enable interface flexibility for peripherals, buses, and board-level interconnects.
• Package & Mounting  Available in a 256-pin FPBGA (17 × 17) package for high-pin-count designs; intended for surface-mount assembly.
• Power  Operates from a core supply range of 1.14 V to 1.26 V to match system power domains and regulator choices.
• Operating Conditions  Rated for commercial temperature operation from 0 °C to 85 °C and specified as a commercial-grade component.
• Environmental Compliance  RoHS compliant to support lead-free manufacturing processes.

Typical Applications

• Commercial Embedded Systems  Reconfigurable logic for control, glue logic, and custom peripheral interfaces in commercial products.
• Interface Bridging  Implement bus translators, protocol adapters, or custom I/O handling using the device's abundant I/O and logic resources.
• Prototyping and Development  Use as a development platform for evaluating custom logic implementations and validating system-level functions.
• Board-Level Integration  Integrate programmable functions in space-constrained designs enabled by the 256-FPBGA package and surface-mount form factor.

Unique Advantages

• Balanced Logic and Memory:  21,000 logic elements combined with approximately 0.283 Mbits of embedded RAM supports a wide range of mid-range designs without external memory.
• High I/O Count:  193 I/O pins provide flexibility to interface multiple peripherals and buses, reducing the need for external glue logic.
• Compact BGA Package:  The 256-FPBGA (17 × 17) package enables a high-pin-count, compact board footprint for space-conscious designs.
• Commercial Temperature Range:  Rated 0 °C to 85 °C to meet typical commercial deployment environments and applications.
• RoHS Compliant:  Supports lead-free manufacturing processes and environmental compliance requirements.

Why Choose LFE2-20E-5FN256C?

This FPGA delivers a practical combination of logic capacity, embedded memory, and a high I/O count in a compact 256-FPBGA package, making it well suited for commercial embedded designs that require flexible, reconfigurable logic. Its supply voltage range and surface-mount package allow integration into contemporary board designs while meeting RoHS requirements.

The LFE2-20E-5FN256C is appropriate for designers and procurement teams seeking a commercially rated FPGA option for interface control, prototyping, and mid-range logic implementations where on-chip memory and ample I/O are important.

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