LFE2-20E-5FN256I

The LFE2-20E-5FN256I is an ECP2 Field Programmable Gate Array (FPGA) IC providing a balance of programmable logic, embedded memory and high I/O count in a compact BGA package. It is specified for industrial operation and is intended for designs that require configurable logic capacity alongside robust I/O and memory resources.

Key characteristics include 21,000 logic elements, 282,624 bits of on-chip RAM, 193 user I/O pins, an industrial operating temperature range, and a 256-ball FPBGA package—making it appropriate for industrial and embedded applications that need moderate logic density with substantial connectivity.

Key Features

• Core Logic 21,000 logic elements provide programmable logic resources for implementing custom digital functions and control logic.
• Embedded Memory Approximately 0.283 Mbits of on-chip RAM (282,624 total RAM bits) to support data buffering, state storage and small LUT-based memories.
• I/O Capacity 193 user I/O pins enable wide parallel interfaces and multiple peripheral connections in a single device.
• Power Supply Core voltage range specified at 1.14 V to 1.26 V to guide power-supply design and integration.
• Package 256-ball FPBGA (17 × 17 mm) package for a compact footprint with high pin density.
• Temperature Range Industrial-grade operation from –40 °C to 100 °C for deployment in temperature-demanding environments.
• RoHS Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial Automation — Implement custom control logic, signal aggregation and interface bridging in factory and process-control equipment using the device’s industrial temperature range and I/O count.
• Embedded Systems — Use as a programmable logic hub for embedded designs requiring moderate logic capacity combined with on-chip memory for buffering and state machines.
• High-density I/O Interfaces — Support multiple parallel or serial interfaces where many user I/Os are needed for sensors, actuators or external peripherals.

Unique Advantages

• High Logic Capacity: 21,000 logic elements enable substantial custom logic implementation without external glue logic.
• Significant On-chip Memory: Approximately 0.283 Mbits of embedded RAM reduce dependence on external memory for moderate buffering and storage needs.
• Ample Connectivity: 193 user I/Os support flexible system integration and multiple peripheral connections from a single FPGA.
• Industrial Temperature Rating: Specified operation from –40 °C to 100 °C provides robustness for deployments in harsh environments.
• Compact, High-density Package: 256-ball FPBGA (17 × 17 mm) lets you pack high pin count into a small PCB area.
• Defined Power Envelope: Core supply range of 1.14–1.26 V simplifies power design and supply selection.

Why Choose LFE2-20E-5FN256I?

The LFE2-20E-5FN256I positions itself as a practical choice for engineers seeking a mid-density FPGA with a strong mix of logic, embedded memory and I/O in an industrial-grade package. Its combination of 21,000 logic elements, approximately 0.283 Mbits of RAM and 193 I/Os provides the resources needed for embedded control, interface consolidation and moderate data-path tasks while supporting –40 °C to 100 °C operation.

This device is suited for design teams focused on compact board area, defined power requirements and extended temperature operation. Its feature set offers a scalable option for systems that need integrated programmable logic with substantial I/O and on-chip memory.

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