LFE2-20E-5FN672C

The LFE2-20E-5FN672C is an ECP2 family Field Programmable Gate Array (FPGA) in a 672-FPBGA (27×27) package, offered in a commercial-grade configuration. It provides a balanced combination of programmable logic, on-chip memory and a high I/O count for compact, surface-mount designs.

With 21,000 logic elements, 282,624 bits of embedded RAM and 402 I/O, this device targets commercial embedded applications that require moderate logic density, substantial on-chip memory and extensive external connectivity while operating from a 1.14 V supply.

Key Features

• Core Capacity  21,000 logic elements provide a flexible fabric for custom logic implementation, state machines and glue logic.
• Embedded Memory  282,624 bits of total on-chip RAM (approximately 0.283 Mbits) to support buffering, FIFOs and small data storage without external memory.
• I/O Density  402 general-purpose I/O pins to handle multiple external interfaces, sensors and peripherals from a single device.
• Power  Single supply operation specified at 1.14 V for the core.
• Package & Mounting  Supplied in a 672-FPBGA (27×27) package case and intended for surface-mount assembly, enabling high-density board layouts.
• Operating Range  Commercial temperature range from 0 °C to 85 °C for typical commercial-environment deployments.
• Grade  Commercial grade device suited for mainstream electronic products and development projects.

Typical Applications

• Commercial embedded systems  Use where moderate logic density and substantial on-chip RAM are needed for control, protocol handling or data buffering in commercial products.
• High-density I/O control  Systems that require a large number of external connections can leverage the 402 I/O pins for peripheral interfacing and signal aggregation.
• Custom logic and glue logic  Ideal for integrating custom timing, interface bridging and application-specific processing using 21,000 logic elements.

Unique Advantages

• Significant logic capacity: 21,000 logic elements deliver the programmable resources needed for complex control and interface logic without immediate dependence on larger devices.
• On-chip memory reduces BOM: 282,624 bits of embedded RAM lower the need for external memory components for small- to mid-size buffering and storage tasks.
• Extensive I/O count: 402 I/O pins simplify system design by consolidating multiple signal interfaces onto a single FPGA package.
• Compact, assembly-ready package: 672-FPBGA (27×27) in a surface-mount format supports compact board layouts and automated assembly processes.
• Commercial temperature suitability: Rated 0 °C to 85 °C for reliable operation in typical commercial environments.

Why Choose LFE2-20E-5FN672C?

The LFE2-20E-5FN672C positions itself as a balanced commercial-grade FPGA option combining 21,000 logic elements, roughly 0.283 Mbits of embedded RAM and a 402-pin I/O complement in a compact 672-FPBGA package. These characteristics make it well suited for developers and product teams building commercial embedded systems that require integrated logic, memory and high I/O density in a single surface-mount component.

Choosing this device supports designs that favor moderate-density programmable logic with substantial on-chip resources and a defined commercial operating range. It is appropriate for customers seeking scalability within the ECP2 family and straightforward integration onto compact printed circuit boards.

If you would like pricing, availability or to request a formal quote for LFE2-20E-5FN672C, please submit a quote request or sales inquiry referencing the part number.