LFE2-20E-5Q208I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 131 282624 21000 208-BFQFP |
|---|---|
| Quantity | 580 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 131 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2625 | Number of Logic Elements/Cells | 21000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFE2-20E-5Q208I – ECP2 FPGA, 21,000 Logic Elements, 208-BFQFP
The LFE2-20E-5Q208I is an ECP2 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides approximately 21,000 logic elements, roughly 282,624 bits of on-chip RAM (about 0.28 Mbits), and up to 131 user I/Os in a 208-BFQFP surface-mount package.
With a core supply range of 1.14 V to 1.26 V and an industrial operating temperature range of −40°C to 100°C, this device is specified for applications that require programmable logic capacity, on-chip memory, and a moderate number of general-purpose I/Os in a 208-pin PQFP footprint.
Key Features
- Logic Capacity Approximately 21,000 logic elements to implement custom digital functions and mid-sized FPGA designs.
- Embedded Memory Approximately 282,624 bits (≈0.28 Mbits) of on-chip RAM for buffering, state machines, and small data storage.
- I/O Resources Up to 131 general-purpose I/Os to support multiple parallel interfaces and peripheral connections.
- Core Power Narrow core voltage supply range of 1.14 V to 1.26 V for predictable power domain design.
- Package & Mounting 208-BFQFP package (supplier device package: 208-PQFP, 28 × 28) in a surface-mount form factor for board-level integration.
- Industrial Temperature Range Specified to operate from −40°C to 100°C for industrial environments.
- Regulatory Compliance RoHS compliant.
Typical Applications
- Programmable control and interface logic Implements custom control functions and I/O aggregation where up to 131 user I/Os and mid-level logic density are required.
- Data buffering and small memory tasks Uses the on-chip RAM for buffering, FIFOs, and small embedded storage in streaming or packetized data paths.
- Prototype and board-level integration Surface-mount 208-pin PQFP package simplifies replacement of discrete glue-logic with a programmable solution during development cycles.
Unique Advantages
- Balanced logic and memory Combines roughly 21,000 logic elements with approximately 0.28 Mbits of embedded RAM to handle control logic and modest data storage without external memory.
- Ample I/O count 131 I/Os support multiple peripheral connections and parallel interfaces without immediate need for external I/O expanders.
- Industrial temperature support Rated for −40°C to 100°C operation, allowing deployment in a wide range of industrial environments.
- Compact package 208-BFQFP / 208-PQFP (28 × 28) surface-mount package offers a compact footprint suitable for dense board layouts.
- Regulatory assurance RoHS compliance supports environmentally conscious designs and supply-chain requirements.
Why Choose LFE2-20E-5Q208I?
The LFE2-20E-5Q208I positions itself as a mid-range FPGA option within the ECP2 family by delivering a practical balance of logic density, embedded RAM, and I/O count in a 208-pin PQFP package. Its specified core voltage range and industrial temperature rating make it suitable for applications that require stable, predictable power domains and operation across extended temperature conditions.
This device is well suited for designers seeking a programmable, solderable solution for board-level integration that reduces discrete logic count while providing on-chip memory and a significant number of user I/Os. Its RoHS compliance and standardized package help simplify procurement and assembly for production designs.
Request a quote or submit a sales inquiry to receive pricing, availability, and additional technical support for the LFE2-20E-5Q208I.

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