LFE2-20E-5FN672I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 402 282624 21000 672-BBGA |
|---|---|
| Quantity | 1,315 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 402 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2625 | Number of Logic Elements/Cells | 21000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFE2-20E-5FN672I – ECP2 Field Programmable Gate Array (FPGA) IC 402 I/O, ~0.28 Mbits RAM, 21,000 Logic Elements
The LFE2-20E-5FN672I is an ECP2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for industrial-grade applications. It delivers a balanced combination of logic capacity, embedded memory, and high I/O density in a compact ball-grid array package.
With 21,000 logic elements, approximately 0.28 Mbits of embedded RAM, 402 I/Os, a 672-BBGA (672-FPBGA, 27×27) package and a wide operating temperature range, this device targets industrial systems that require reliable digital logic integration and robust operating conditions.
Key Features
- Logic Capacity 21,000 logic elements to implement moderate-density digital designs and custom logic functions.
- Embedded Memory Approximately 0.28 Mbits (282,624 bits) of on-chip RAM to support buffering, state machines, and small data storage needs.
- High I/O Count 402 I/O pins to connect to multiple peripherals, sensors, and external interfaces without external multiplexing.
- Power Supply Core voltage range from 1.14 V to 1.26 V to match platform power architectures.
- Package 672-BBGA package (supplier device package: 672-FPBGA, 27×27) for high pin density in a compact surface-mount form factor.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
- RoHS Compliant Meets RoHS requirements for hazardous substances.
Typical Applications
- Industrial Control Implement real-time control logic, sequencers, and custom processing functions in industrial automation systems that require an industrial-grade device.
- High-density I/O Systems Deploy as a central I/O hub for sensor arrays, communication front-ends, or interface bridging where a large number of I/Os is needed.
- Embedded Logic and Memory Use embedded RAM and logic elements for buffering, protocol handling, and custom state machines in compact embedded designs.
Unique Advantages
- Substantial Logic Resources: 21,000 logic elements provide the capacity to implement complex custom logic without moving to a larger device family.
- Significant On-chip Memory: Approximately 0.28 Mbits of embedded RAM reduces reliance on external memory for small to medium buffering needs.
- Extensive I/O Connectivity: 402 I/O pins simplify designs that require many interfaces, lowering the need for external I/O expanders.
- Industrial-grade Operation: −40 °C to 100 °C operating range supports deployment in demanding industrial environments.
- Compact, High-density Package: 672-BBGA (672-FPBGA, 27×27) enables high pin count in a small footprint for space-constrained boards.
- Low-voltage Core: 1.14 V to 1.26 V supply range aligns with modern low-voltage power domains for efficient integration.
Why Choose LFE2-20E-5FN672I?
The LFE2-20E-5FN672I positions itself as an industrial-grade FPGA option that balances logic capacity, embedded memory, and very high I/O density in a compact package. Its specifications make it well suited for designers who need robust operation across a wide temperature range while maintaining broad connectivity and on-chip resources.
Manufactured by Lattice Semiconductor Corporation, this device is appropriate for projects that require a reliable, industrially rated FPGA with mid-range logic and memory resources, particularly where board space and I/O count are key considerations.
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