LFE2-20E-5FN484I

IC FPGA 331 I/O 484FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 331 282624 21000 484-BBGA

Quantity 887 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O331Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2625Number of Logic Elements/Cells21000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFE2-20E-5FN484I – ECP2 FPGA, 21,000 Logic Elements, 331 I/O, 484-BBGA

The LFE2-20E-5FN484I is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a balance of programmable logic capacity, embedded memory, and a high-count I/O complement in a compact 484-BBGA package.

Designed for applications that require moderate logic density and extensive I/O, this device offers low-voltage operation and an industrial temperature rating for deployment in temperature-challenging environments.

Key Features

  • Core Logic 21,000 logic elements provide programmable resources for implementing custom digital functions and state machines.
  • Embedded Memory Approximately 0.28 Mbits of on-chip RAM (282,624 total bits) for buffering, FIFOs, and small lookup tables.
  • High I/O Count 331 user I/O pins support complex interfacing and multiple parallel buses or peripheral connections.
  • Power Low-voltage supply range from 1.14 V to 1.26 V to support power-sensitive designs.
  • Package & Mounting 484-BBGA (supplier package 484-FPBGA, 23×23) in a surface-mount form factor for compact PCB layouts.
  • Temperature Range Industrial operating temperature from −40 °C to 100 °C for robust operation in demanding environments.
  • Environmental Compliance RoHS compliant to meet lead-free and environmental requirements.

Typical Applications

  • I/O-Intensive Interface Modules Leverages 331 I/O pins to bridge multiple parallel interfaces or connect large sensor arrays and external peripherals.
  • Embedded Logic and Control 21,000 logic elements enable implementation of custom control, protocol handling, and signal processing functions.
  • Industrial Automation The industrial temperature rating and surface-mount 484-BBGA package make it suitable for control and monitoring equipment in challenging thermal environments.
  • Prototype and Development Platforms Provides a flexible platform for evaluating custom logic functions and early-stage product validation where moderate memory and I/O are required.

Unique Advantages

  • Substantial Logic Density: 21,000 logic elements give designers room to implement complex finite-state machines and combinatorial logic without immediate up-scaling.
  • Significant On-Chip RAM: Approximately 0.28 Mbits of embedded memory supports local buffering and small data structures, reducing external memory needs.
  • Extensive Connectivity: 331 I/O pins enable rich peripheral interfacing and parallel data throughput for demanding I/O scenarios.
  • Low-Voltage Operation: Narrow supply range (1.14 V–1.26 V) supports designs where power rail constraints or low-voltage domains are a factor.
  • Industrial Temperature Capability: Rated from −40 °C to 100 °C for deployment in temperature-variable industrial applications.
  • Compact BGA Package: 484-BBGA (23×23) surface-mount package optimizes board area while maintaining high I/O density.

Why Choose LFE2-20E-5FN484I?

The LFE2-20E-5FN484I positions itself as a versatile mid-range FPGA offering a practical mix of logic resources, embedded memory, and a very high I/O count in a compact BGA package. Its low-voltage operation and industrial temperature rating make it suitable for designs that must balance power constraints with reliable operation across a wide thermal range.

Engineers specifying this device will benefit from a solution that supports complex interfacing and custom logic implementation while meeting RoHS environmental requirements and surface-mount assembly needs.

Request a quote or submit an inquiry to check availability and pricing for LFE2-20E-5FN484I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up