LFE2-20E-5FN484C

The LFE2-20E-5FN484C is an ECP2 family field programmable gate array (FPGA) from Lattice Semiconductor designed for system integration projects that require dense logic, embedded memory and flexible I/O in a compact surface-mount package. The device provides approximately 21,000 logic elements, about 282,624 bits of on-chip RAM, and up to 331 general-purpose I/Os in a 484-ball BGA (23 × 23 mm) footprint.

Targeted at commercial-grade applications, this FPGA balances logic density, embedded memory and configurable I/O standards to support compute, control and interface functions within constrained board-area and power envelopes.

Key Features

• Logic Capacity — Approximately 21,000 logic elements for implementing mid-sized combinational and sequential logic functions.
• Embedded Memory — Approximately 282,624 bits (~276 Kbits) of on-chip RAM for data buffering, state storage and small memory structures.
• DSP Resources — ECP2-series architecture provides sysDSP block support as documented for the family (device-level DSP resources available in ECP2 family devices).
• I/O Density and Package — Up to 331 I/Os available in the 484-ball fpBGA (23 × 23 mm) package, enabling high pin-count interfaces in a compact package.
• Power Supply — Core supply specified from 1.14 V to 1.26 V, suitable for standard low-voltage FPGA power rails.
• Mounting and Grade — Surface-mount device rated for commercial temperature range (0 °C to 85 °C) and RoHS compliant.
• Configuration and System Support — Family-level features include flexible device configuration and system-level aids (refer to Lattice ECP2 family documentation for supported configuration options).

Typical Applications

• Embedded Control — Implement control logic, peripheral bridges and glue logic where compact package and mid-range LUT count meet system needs.
• Data Path Acceleration — Use on-chip RAM and DSP resources for packet buffering, finite impulse response (FIR) filtering or other moderate DSP tasks.
• Interface Aggregation — Consolidate multiple I/O functions and protocol translation in a single device leveraging up to 331 I/Os in the 484-BBGA package.
• Prototyping and Development — Suitable for hardware development and verification of FPGA-based subsystems requiring mid-range logic and embedded memory capacity.

Unique Advantages

• Balanced integration: Combines ~21,000 logic elements and ~282,624 bits of embedded RAM to reduce external memory and glue logic needs.
• High I/O count in compact package: 331 I/Os in a 23 × 23 mm 484-BBGA package enables dense connectivity without a large board footprint.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for broad commercial deployment.
• Low-voltage core: 1.14 V to 1.26 V supply range aligns with modern power-optimized designs.
• Surface-mount form factor: Standard SMT BGA packaging supports automated assembly and high-density PCB layouts.

Why Choose LFE2-20E-5FN484C?

The LFE2-20E-5FN484C positions itself as a practical mid-range FPGA option for commercial designs that require a mix of logic density, embedded memory and abundant I/O in a space-efficient BGA package. Its specification set makes it suitable for teams implementing control logic, moderate DSP acceleration and multi-interface aggregation without stepping up to larger, higher-cost devices.

Engineers benefit from a scalable family architecture and documented family-level capabilities, allowing reuse of design approaches and easing integration into existing tool flows and development processes.

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