LFE2-20E-5F672C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 402 282624 21000 672-BBGA |
|---|---|
| Quantity | 642 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 402 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2625 | Number of Logic Elements/Cells | 21000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFE2-20E-5F672C – ECP2 Field Programmable Gate Array, 21,000 Logic Elements, 672-BBGA
The LFE2-20E-5F672C is an ECP2 Field Programmable Gate Array from Lattice Semiconductor Corporation, offering a balance of logic capacity, I/O density, and on-chip memory for commercial embedded applications. Its architecture provides 21,000 logic elements, 402 user I/O pins, and approximately 0.28 Mbits of embedded memory, packaged in a compact 672-BBGA surface-mount package.
Designed for systems operating on low core voltages, this FPGA supports a supply range of 1.14 V to 1.26 V and is specified for commercial temperature operation from 0 °C to 85 °C. It is RoHS compliant for environmental compatibility.
Key Features
- Core Logic 21,000 logic elements provide capacity for moderate-complexity combinational and sequential logic implementations.
- Embedded Memory Approximately 0.28 Mbits of on-chip RAM suitable for buffering, small FIFOs, and lookup tables.
- I/O Density 402 user I/O pins enable extensive peripheral and bus interfacing on a single device.
- Package 672-BBGA package (supplier device package: 672-FPBGA, 27×27) supports dense board layouts while maintaining a surface-mount form factor.
- Power Core supply voltage range of 1.14 V to 1.26 V for compatibility with low-voltage system rails.
- Temperature & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
- Environmental Compliance RoHS compliant for restriction of hazardous substances.
Typical Applications
- Embedded Control and Glue Logic Use the 21,000 logic elements and abundant I/O to integrate custom control functions and interface glue on commercial products.
- High-Density Peripheral Interfacing 402 I/O pins enable aggregation and routing of multiple peripherals and buses within a compact package footprint.
- On-Chip Data Buffering Approximately 0.28 Mbits of embedded RAM supports small buffering and temporary data storage for data flow and protocol handling.
- Compact, High-Integration Board Designs The 672-BBGA surface-mount package allows for space-efficient placement in designs where board area and pin count are critical.
Unique Advantages
- High Logic Capacity: 21,000 logic elements let you implement substantial custom logic without external gate arrays or CPLDs.
- Extensive I/O Count: 402 user I/O pins reduce the need for external multiplexers or expanders when connecting multiple peripherals.
- On-Board Memory: Approximately 0.28 Mbits of embedded RAM provides local storage for buffering and state machines, simplifying system design.
- Compact BGA Package: The 672-BBGA (672-FPBGA, 27×27) supports dense routing and minimizes PCB footprint for space-constrained applications.
- Low-Voltage Core Compatibility: Operates from 1.14 V to 1.26 V to match modern low-voltage system rails.
- Commercial Grade with RoHS Compliance: Rated for 0 °C to 85 °C and RoHS compliant for deployment in commercial product lines.
Why Choose LFE2-20E-5F672C?
The LFE2-20E-5F672C positions itself as a versatile commercial-grade FPGA for designers who need a mid-range logic device with high I/O count and on-chip memory in a compact BGA package. Its combination of 21,000 logic elements, 402 I/Os, and approximately 0.28 Mbits of embedded RAM supports a wide range of commercial embedded and interface-centric applications.
Manufactured by Lattice Semiconductor Corporation and specified for operation from 0 °C to 85 °C with RoHS compliance, this device is suitable for product development where low-voltage core operation, board-area efficiency, and rich I/O are priorities.
Request a quote or submit a pricing inquiry today to receive availability and lead-time information for the LFE2-20E-5F672C.