LFE2-20E-5F672C

IC FPGA 402 I/O 672FPBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 402 282624 21000 672-BBGA

Quantity 642 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O402Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2625Number of Logic Elements/Cells21000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFE2-20E-5F672C – ECP2 Field Programmable Gate Array, 21,000 Logic Elements, 672-BBGA

The LFE2-20E-5F672C is an ECP2 Field Programmable Gate Array from Lattice Semiconductor Corporation, offering a balance of logic capacity, I/O density, and on-chip memory for commercial embedded applications. Its architecture provides 21,000 logic elements, 402 user I/O pins, and approximately 0.28 Mbits of embedded memory, packaged in a compact 672-BBGA surface-mount package.

Designed for systems operating on low core voltages, this FPGA supports a supply range of 1.14 V to 1.26 V and is specified for commercial temperature operation from 0 °C to 85 °C. It is RoHS compliant for environmental compatibility.

Key Features

  • Core Logic  21,000 logic elements provide capacity for moderate-complexity combinational and sequential logic implementations.
  • Embedded Memory  Approximately 0.28 Mbits of on-chip RAM suitable for buffering, small FIFOs, and lookup tables.
  • I/O Density  402 user I/O pins enable extensive peripheral and bus interfacing on a single device.
  • Package  672-BBGA package (supplier device package: 672-FPBGA, 27×27) supports dense board layouts while maintaining a surface-mount form factor.
  • Power  Core supply voltage range of 1.14 V to 1.26 V for compatibility with low-voltage system rails.
  • Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant for restriction of hazardous substances.

Typical Applications

  • Embedded Control and Glue Logic  Use the 21,000 logic elements and abundant I/O to integrate custom control functions and interface glue on commercial products.
  • High-Density Peripheral Interfacing  402 I/O pins enable aggregation and routing of multiple peripherals and buses within a compact package footprint.
  • On-Chip Data Buffering  Approximately 0.28 Mbits of embedded RAM supports small buffering and temporary data storage for data flow and protocol handling.
  • Compact, High-Integration Board Designs  The 672-BBGA surface-mount package allows for space-efficient placement in designs where board area and pin count are critical.

Unique Advantages

  • High Logic Capacity: 21,000 logic elements let you implement substantial custom logic without external gate arrays or CPLDs.
  • Extensive I/O Count: 402 user I/O pins reduce the need for external multiplexers or expanders when connecting multiple peripherals.
  • On-Board Memory: Approximately 0.28 Mbits of embedded RAM provides local storage for buffering and state machines, simplifying system design.
  • Compact BGA Package: The 672-BBGA (672-FPBGA, 27×27) supports dense routing and minimizes PCB footprint for space-constrained applications.
  • Low-Voltage Core Compatibility: Operates from 1.14 V to 1.26 V to match modern low-voltage system rails.
  • Commercial Grade with RoHS Compliance: Rated for 0 °C to 85 °C and RoHS compliant for deployment in commercial product lines.

Why Choose LFE2-20E-5F672C?

The LFE2-20E-5F672C positions itself as a versatile commercial-grade FPGA for designers who need a mid-range logic device with high I/O count and on-chip memory in a compact BGA package. Its combination of 21,000 logic elements, 402 I/Os, and approximately 0.28 Mbits of embedded RAM supports a wide range of commercial embedded and interface-centric applications.

Manufactured by Lattice Semiconductor Corporation and specified for operation from 0 °C to 85 °C with RoHS compliance, this device is suitable for product development where low-voltage core operation, board-area efficiency, and rich I/O are priorities.

Request a quote or submit a pricing inquiry today to receive availability and lead-time information for the LFE2-20E-5F672C.

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