LFE2-20E-6F256I

The LFE2-20E-6F256I is an ECP2 family Field Programmable Gate Array (FPGA) in a 256‑ball BGA package designed for industrial applications. It provides a combination of programmable logic, embedded memory, and a high I/O count to implement custom digital functions in space‑constrained assemblies.

With 21,000 logic elements, approximately 0.28 Mbits of embedded RAM, and 193 general-purpose I/O, this device targets systems that require moderate logic density, substantial on‑chip memory, and robust I/O connectivity while operating across an extended industrial temperature range.

Key Features

• Core Logic 21,000 logic elements to implement custom digital designs and moderate-density FPGA functions.
• Embedded Memory Approximately 0.28 Mbits of on‑chip RAM for buffering, lookup tables, and small data storage requirements.
• I/O Capacity 193 general-purpose I/O pins to support wide peripheral and interface connectivity directly from the FPGA.
• Power Low-voltage core operation with a supply range of 1.14 V to 1.26 V for the programmable core domain.
• Package and Mounting 256‑BGA (256‑FPBGA, 17 × 17) surface-mount package providing a compact footprint for board-level integration.
• Temperature and Grade Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in extended-temperature environments.
• Environmental Compliance RoHS‑compliant construction to meet common regulatory and manufacturing requirements.

Typical Applications

• Industrial Automation Implement control logic, sensor interfacing, and custom I/O processing using the device’s 193 I/O and 21,000 logic elements.
• Embedded Systems Integrate application-specific functions and small memory buffers within constrained board layouts via the 256‑BGA package and embedded RAM.
• Communications and Networking Provide protocol bridging, packet processing helpers, or peripheral aggregation where moderate logic density and flexible I/O are required.
• Instrumentation and Test Equipment Realize custom timing, I/O conditioning, and on‑chip data handling in environments that require industrial temperature operation.

Unique Advantages

• Balanced Logic and Memory: 21,000 logic elements paired with approximately 0.28 Mbits of embedded RAM allow combined compute and buffering on a single device.
• High I/O Count: 193 I/O pins simplify system design by reducing the need for external I/O expanders and enabling direct peripheral connections.
• Compact, Board-Friendly Package: The 256‑FPBGA (17×17) package delivers a compact footprint suitable for space-constrained PCBs.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in extended-temperature industrial environments.
• Low-Voltage Core Operation: Core supply between 1.14 V and 1.26 V supports low-voltage system architectures.
• Regulatory Compliance: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose LFE2-20E-6F256I?

The LFE2-20E-6F256I provides a practical balance of logic density, embedded memory, and a substantial I/O count in a compact 256‑BGA package, making it well suited for industrial and embedded designs that require configurable digital logic, local data storage, and numerous external connections. Its industrial temperature rating and RoHS compliance support deployment in extended-temperature systems and modern manufacturing environments.

This FPGA is a solid option for engineers and procurement teams looking for a single-device solution to implement custom control, interfacing, and processing tasks while minimizing board-level component count and preserving PCB area.

Request a quote or submit an inquiry to obtain pricing and availability for the LFE2-20E-6F256I.