LFE2-20E-6F484C

The LFE2-20E-6F484C is a commercial-grade Field Programmable Gate Array (FPGA) designed for configurable digital logic and system integration. It provides a balance of programmable logic capacity, on-chip memory, and a high I/O count in a compact 484-ball BGA package for surface-mount assembly.

Targeted at applications requiring flexible digital implementation and dense I/O connectivity, this device delivers measurable on-chip resources and low-voltage operation to support modern board designs.

Key Features

• Logic Capacity — 21,000 logic elements and 2,625 logic blocks provide a substantial fabric for implementing custom digital functions and glue logic.
• Embedded Memory — 282,624 total RAM bits, approximately 0.283 Mbits of embedded memory, for buffering, FIFOs, and small data stores directly on-chip.
• I/O Density — 331 general-purpose I/O pins to support multiple interfaces, parallel peripherals, and board-level connectivity.
• Power — Low-voltage core operation with a specified supply range of 1.14 V to 1.26 V for the programmable fabric.
• Package & Mounting — 484-ball BBGA package (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for compact PCB layouts.
• Operating Range & Grade — Commercial-grade device rated for 0 °C to 85 °C ambient operation.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Custom Digital Logic — Implement application-specific finite state machines, data paths, and protocol handlers using the device's logic elements and embedded RAM.
• High-Density I/O Integration — Aggregate multiple peripheral interfaces or bridge signals across subsystems using the device's extensive I/O count.
• Embedded System Glue — Integrate control logic, timing, and interface adaptation beneath a compact BGA footprint for board-level consolidation.

Unique Advantages

• Substantial Logic Resources: 21,000 logic elements enable sizeable custom logic implementations without external ASIC development.
• On-Chip Memory: Approximately 0.283 Mbits of embedded RAM reduces dependency on external memory for small buffers and control structures.
• High I/O Count: 331 I/Os simplify system partitioning and reduce the need for additional I/O expanders.
• Compact Surface-Mount Package: 484-ball FPBGA (23×23) allows dense PCB designs while maintaining robust connectivity.
• Low-Voltage Core: 1.14 V to 1.26 V supply supports designs targeting lower core power consumption and modern power rails.
• Regulatory Fit for Commercial Designs: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose LFE2-20E-6F484C?

The LFE2-20E-6F484C positions itself as a practical, commercial-grade FPGA option combining meaningful logic density, embedded memory, and broad I/O capability in a compact BGA package. Its specifications make it suitable for design teams needing reconfigurable digital logic and board-level integration while operating within standard commercial temperature ranges.

Choose this device when you need a scalable, programmable solution that keeps system BOM complexity down by consolidating logic, buffering, and I/O in a single surface-mount component backed by RoHS compliance and documented supplier packaging.

Request a quote or submit a purchase inquiry for the LFE2-20E-6F484C to check availability and pricing for your next design.