LFE2-20E-6F484I

IC FPGA 331 I/O 484FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 331 282624 21000 484-BBGA

Quantity 1,747 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O331Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2625Number of Logic Elements/Cells21000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFE2-20E-6F484I – ECP2 Field Programmable Gate Array (FPGA) IC, 331 I/O, 21,000 Logic Elements, 282,624-bit Embedded RAM, 484-BBGA

The LFE2-20E-6F484I is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor. It delivers a balanced combination of logic capacity, on-chip memory and a large I/O complement in a compact ball-grid package.

With approximately 21,000 logic elements, roughly 0.28 Mbits of embedded RAM (282,624 bits), 331 I/O and support for industrial operating temperatures, this device is suited to designs that require substantial I/O, moderate logic density and robust temperature performance while operating at low core voltages.

Key Features

  • Logic Capacity Approximately 21,000 logic elements providing programmable fabric for custom digital functions.
  • Embedded Memory Approximately 0.28 Mbits of on-chip RAM (282,624 bits) for buffering, state storage and small data structures.
  • I/O Density 331 general-purpose I/O pins to support parallel interfaces, multiple peripherals and board-level connectivity.
  • Power Core supply range of 1.14 V to 1.26 V to match low-voltage system architectures.
  • Package and Mounting 484-ball BBGA package (484-FPBGA, 23 × 23 mm) in a surface-mount form factor for compact board layouts.
  • Industrial Temperature and Grade Rated for operation from -40 °C to 100 °C and specified as Industrial grade for thermal robustness in demanding environments.
  • RoHS Compliance RoHS compliant to support regulatory requirements for lead-free manufacturing.

Typical Applications

  • Industrial Control — Leverage the industrial temperature rating and substantial I/O count for PLCs, motor drives and factory automation interfaces.
  • Embedded Systems — Implement custom peripherals, protocol bridges or control logic where moderate logic density and embedded RAM simplify board-level design.
  • Communications Equipment — Use the large I/O complement and on-chip memory for interface aggregation, protocol handling and data buffering.
  • Test & Measurement — Apply the device’s programmable logic and I/O capacity to custom signal processing, measurement control and data capture tasks.

Unique Advantages

  • Balanced Logic and Memory: Approximately 21,000 logic elements paired with ~0.28 Mbits of on-chip RAM enables a wide range of mid-range designs without external memory for many tasks.
  • High I/O Count: 331 I/O pins provide flexibility to connect multiple sensors, interfaces and peripherals directly to the FPGA fabric.
  • Compact Ball-Grid Package: The 484-BBGA (23 × 23 mm) package delivers dense functionality in a space-efficient surface-mount footprint.
  • Low-Voltage Operation: Core supply from 1.14 V to 1.26 V supports integration into modern low-voltage systems and power-optimized designs.
  • Industrial Temperature Range: Rated for -40 °C to 100 °C operation for reliable performance in harsh or temperature-variable environments.
  • Regulatory Compliance: RoHS compliant to meet lead‑free manufacturing requirements.

Why Choose LFE2-20E-6F484I?

The LFE2-20E-6F484I occupies a mid-range FPGA position within the ECP2 family, offering a practical mix of logic resources, embedded RAM and a high I/O count in a compact 484-BBGA package. Its low core voltage and industrial temperature rating make it appropriate for systems that prioritize integration, I/O connectivity and thermal robustness.

This device is well suited for engineers and designers building industrial control, embedded computing, communications and test equipment who need a scalable, programmable fabric from a known FPGA family. Its combination of on-chip resources and package density delivers a durable platform for production designs.

Request a quote or submit an inquiry to receive pricing and availability for the LFE2-20E-6F484I.

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