LFE2-20E-6F484I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 331 282624 21000 484-BBGA |
|---|---|
| Quantity | 1,747 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 331 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2625 | Number of Logic Elements/Cells | 21000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFE2-20E-6F484I – ECP2 Field Programmable Gate Array (FPGA) IC, 331 I/O, 21,000 Logic Elements, 282,624-bit Embedded RAM, 484-BBGA
The LFE2-20E-6F484I is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor. It delivers a balanced combination of logic capacity, on-chip memory and a large I/O complement in a compact ball-grid package.
With approximately 21,000 logic elements, roughly 0.28 Mbits of embedded RAM (282,624 bits), 331 I/O and support for industrial operating temperatures, this device is suited to designs that require substantial I/O, moderate logic density and robust temperature performance while operating at low core voltages.
Key Features
- Logic Capacity Approximately 21,000 logic elements providing programmable fabric for custom digital functions.
- Embedded Memory Approximately 0.28 Mbits of on-chip RAM (282,624 bits) for buffering, state storage and small data structures.
- I/O Density 331 general-purpose I/O pins to support parallel interfaces, multiple peripherals and board-level connectivity.
- Power Core supply range of 1.14 V to 1.26 V to match low-voltage system architectures.
- Package and Mounting 484-ball BBGA package (484-FPBGA, 23 × 23 mm) in a surface-mount form factor for compact board layouts.
- Industrial Temperature and Grade Rated for operation from -40 °C to 100 °C and specified as Industrial grade for thermal robustness in demanding environments.
- RoHS Compliance RoHS compliant to support regulatory requirements for lead-free manufacturing.
Typical Applications
- Industrial Control — Leverage the industrial temperature rating and substantial I/O count for PLCs, motor drives and factory automation interfaces.
- Embedded Systems — Implement custom peripherals, protocol bridges or control logic where moderate logic density and embedded RAM simplify board-level design.
- Communications Equipment — Use the large I/O complement and on-chip memory for interface aggregation, protocol handling and data buffering.
- Test & Measurement — Apply the device’s programmable logic and I/O capacity to custom signal processing, measurement control and data capture tasks.
Unique Advantages
- Balanced Logic and Memory: Approximately 21,000 logic elements paired with ~0.28 Mbits of on-chip RAM enables a wide range of mid-range designs without external memory for many tasks.
- High I/O Count: 331 I/O pins provide flexibility to connect multiple sensors, interfaces and peripherals directly to the FPGA fabric.
- Compact Ball-Grid Package: The 484-BBGA (23 × 23 mm) package delivers dense functionality in a space-efficient surface-mount footprint.
- Low-Voltage Operation: Core supply from 1.14 V to 1.26 V supports integration into modern low-voltage systems and power-optimized designs.
- Industrial Temperature Range: Rated for -40 °C to 100 °C operation for reliable performance in harsh or temperature-variable environments.
- Regulatory Compliance: RoHS compliant to meet lead‑free manufacturing requirements.
Why Choose LFE2-20E-6F484I?
The LFE2-20E-6F484I occupies a mid-range FPGA position within the ECP2 family, offering a practical mix of logic resources, embedded RAM and a high I/O count in a compact 484-BBGA package. Its low core voltage and industrial temperature rating make it appropriate for systems that prioritize integration, I/O connectivity and thermal robustness.
This device is well suited for engineers and designers building industrial control, embedded computing, communications and test equipment who need a scalable, programmable fabric from a known FPGA family. Its combination of on-chip resources and package density delivers a durable platform for production designs.
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