LFE2-20E-6FN256C

The LFE2-20E-6FN256C is an ECP2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides programmable logic with 21,000 logic elements and approximately 0.28 Mbits of embedded memory in a compact 256-ball FPBGA package.

Designed as a commercial-grade, surface-mount FPGA, the device offers a high I/O count and low-voltage operation for tightly integrated digital designs that require substantial on-chip logic and memory resources.

Key Features

• Programmable Logic 21,000 logic elements deliver the device's core programmable functionality for implementing custom logic and control functions.
• Embedded Memory Approximately 0.28 Mbits (282,624 bits) of on-chip RAM to support data buffering, FIFOs, and small on-chip storage needs.
• I/O Capacity 193 general-purpose I/O pins provide a broad interface capability for parallel buses, peripheral connections, and signal routing.
• Package and Mounting 256-ball FPBGA package (256-BGA, supplier package 256-FPBGA 17×17) in a surface-mount form factor for compact board integration.
• Voltage Supply Operates from a core supply range of 1.14 V to 1.26 V, enabling low-voltage system designs.
• Commercial Grade Temperature Range Qualified for operation from 0 °C to 85 °C, matching commercial temperature environments.
• RoHS Compliance Device is RoHS compliant, supporting lead-free manufacturing and regulatory requirements.

Typical Applications

• Programmable logic and prototyping — Use the FPGA’s 21,000 logic elements to implement custom logic blocks and iterate designs on silicon.
• I/O-dense interface bridging — 193 I/O pins support connectivity for protocol translation, bus interfacing, and multi-signal routing.
• On-chip buffering and data handling — Approximately 0.28 Mbits of embedded RAM for temporary data storage, buffering, and small FIFOs.

Unique Advantages

• High logic capacity: 21,000 logic elements enable substantial on-chip logic integration without external programmable components.
• Compact BGA package: 256-FPBGA (17×17) provides a space-efficient footprint for dense board layouts.
• Generous I/O count: 193 I/Os reduce the need for external multiplexing and simplify system-level interfacing.
• Embedded memory on-chip: ~0.28 Mbits of RAM supports local data storage and real-time buffering needs.
• Low-voltage core operation: 1.14–1.26 V supply range supports energy-conscious designs and modern system power architectures.
• RoHS compliant: Meets lead-free manufacturing requirements for modern assembly processes.

Why Choose LFE2-20E-6FN256C?

The LFE2-20E-6FN256C positions itself as a capable, commercial-grade FPGA offering a balance of logic density, embedded memory, and high I/O in a compact 256-BGA package. Its specifications suit designs that require substantial programmable logic and on-chip RAM while maintaining a small PCB footprint and low-voltage core operation.

For designers and procurement teams seeking a RoHS-compliant FPGA with clear, verifiable specifications—21,000 logic elements, ~0.28 Mbits of RAM, 193 I/O, and a 17×17 256-FPBGA package—this device provides a straightforward option for medium-density programmable logic integration.

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