LFE2-20E-6FN484C

The LFE2-20E-6FN484C is an ECP2-family FPGA optimized for system integration in mid-range embedded designs. It provides a LUT-based logic fabric with on-chip DSP and memory resources suitable for signal processing and control applications.

Key on-device resources include 21,000 logic elements, approximately 0.283 Mbits of embedded memory, and 331 I/Os in a 484-ball BGA package. The device is RoHS-compliant, surface-mountable, and specified for commercial operating temperatures.

Key Features

• Core Logic  21,000 logic elements for implementing combinational and sequential logic in mid-density designs.
• Embedded Memory  Approximately 282,624 bits of total on-chip RAM (≈0.283 Mbits) combined with distributed RAM resources for buffering and state storage.
• DSP Resources  sysDSP block support consistent with the ECP2-20 device class, including 7 sysDSP blocks and 28 18×18 multipliers for multiply‑accumulate and signal processing tasks.
• Clocking  Built-in clock management with device-level PLL/DLL resources (2 GPLLs and 2 DLLs for the ECP2-20 device class) to support clock multiplication, division and phase/delay adjustments.
• I/O and Package  331 available I/Os in a 484-ball fpBGA package (484-FPBGA, 23 × 23 mm) for high pin-count system interfaces; surface-mount mounting type.
• Power  Core voltage supply range of 1.14 V to 1.26 V, enabling integration with standard low-voltage power rails.
• Operating Range & Compliance  Commercial-grade operating temperature from 0 °C to 85 °C and RoHS-compliant for environmental regulatory conformance.

Typical Applications

• Embedded Signal Processing  Use the device's DSP blocks and multipliers for filtering, transforms, and other compute-intensive embedded signal tasks.
• Memory Interface and Buffering  On-chip RAM and distributed memory resources enable efficient packet buffering, FIFO implementation, and temporary data storage.
• Protocol Bridging and Glue Logic  High I/O count and flexible I/O packaging make the part suitable for interfacing between subsystems and implementing custom protocol logic.
• System Integration  Compact 484-BBGA package and surface-mount form factor support space-constrained module designs and compact PCBs.

Unique Advantages

• Mid-range Density: 21,000 logic elements deliver a balance of capacity and cost for complex control and processing functions without the overhead of larger devices.
• Integrated DSP Capability: sysDSP blocks and 18×18 multipliers provide dedicated arithmetic resources to accelerate signal-processing workloads and reduce external component count.
• Significant On-chip Memory: Approximately 0.283 Mbits of embedded RAM plus distributed RAM options reduce dependence on external memory for many buffering and state-storage needs.
• High I/O Count in Compact Package: 331 I/Os in a 23 × 23 mm 484-ball fpBGA allow dense connectivity for sensors, peripherals, and subsystems while keeping board area minimal.
• Low-voltage Core: 1.14 V to 1.26 V supply range supports modern low-voltage system designs and helps simplify power-rail planning.
• Commercial Temperature and RoHS Compliance: Commercial-grade thermal specification (0 °C to 85 °C) and RoHS compliance support a wide range of mainstream applications and environmental requirements.

Why Choose LFE2-20E-6FN484C?

The LFE2-20E-6FN484C positions itself as a practical mid-density FPGA for designers who need a balance of logic capacity, DSP acceleration, and on‑chip memory in a compact BGA package. Its combination of 21,000 logic elements, dedicated DSP resources, substantial embedded RAM, and 331 I/Os makes it well suited for embedded signal-processing, interface bridging, and system integration tasks.

Choosing this device provides a scalable platform within the ECP2 family with accessible clocking resources and a low-voltage core, delivering predictable integration and longevity for commercial applications supported by Lattice ECP2 family documentation.

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