LFE2-20E-6Q208C

IC FPGA 131 I/O 208QFP
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 131 282624 21000 208-BFQFP

Quantity 113 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O131Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2625Number of Logic Elements/Cells21000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFE2-20E-6Q208C – ECP2 FPGA, 21,000 logic elements, 131 I/Os, 208-BFQFP

The LFE2-20E-6Q208C is a commercial-grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor’s ECP2 family. It delivers a balanced combination of programmable logic, embedded memory, DSP capability and flexible I/O in a compact 208-pin BFQFP package for commercial embedded designs.

With 21,000 logic elements, 131 user I/Os and approximately 0.283 Mbits of on-chip RAM, this device is suited to system integration tasks that require moderate logic density, configurable interfaces and on-chip memory within a 0°C to 85°C operating range and RoHS-compliant construction.

Key Features

  • Logic Capacity – 21,000 logic elements (cells) for implementing combinational and sequential logic, state machines and glue logic.
  • On-chip Memory – 282,624 total RAM bits (approximately 0.283 Mbits) of embedded memory for buffering, FIFOs and small data stores.
  • DSP Capability – Family-level sysDSP blocks and multiply/accumulate resources provide hardware-accelerated arithmetic for signal processing tasks.
  • Programmable I/O – 131 user I/Os with programmable sysI/O buffers to support a wide range of single-ended and differential signaling standards for interface flexibility.
  • Clocking & Timing – Integrated PLLs and DLLs (sysCLOCK) for clock multiplication, division and phase/delay adjustment to support varied clocking schemes.
  • Configuration & Security – Flexible device configuration options including SPI boot flash interface and support for dual boot images; family documentation notes optional bitstream encryption on designated series.
  • Power & Package – Low-voltage core supply range of 1.14 V to 1.26 V in a 208-pin BFQFP (28 × 28 mm supplier package 208-PQFP) suitable for surface-mount assembly.
  • Commercial Grade & Compliance – Rated for 0°C to 85°C operation and RoHS-compliant.

Typical Applications

  • Embedded Systems – Implement control logic, protocol bridges and custom peripherals where moderate logic density and flexible I/O are required.
  • Signal Processing – Leverage embedded DSP blocks and on-chip RAM for filtering, aggregation and arithmetic-intensive tasks in commercial signal processing designs.
  • Memory Interface Controllers – Use dedicated clocking resources and programmable I/O to support DDR/DDR2 memory interfaces and source-synchronous memory designs.
  • Interface & Protocol Glue – Implement protocol conversion, parallel-to-serial bridging and custom interface logic using the device’s programmable I/O and logic resources.

Unique Advantages

  • Balanced logic and memory – 21,000 logic elements paired with approximately 0.283 Mbits of embedded RAM provide a practical mix for control, buffering and moderate data-path functions.
  • Flexible I/O count – 131 user I/Os in a 208-pin BFQFP package simplify board-level routing while supporting multiple interface standards.
  • Low-voltage core – Core supply range of 1.14 V to 1.26 V enables integration into low-voltage power architectures common in commercial designs.
  • Commercial temperature rating – 0°C to 85°C operation aligns with typical commercial embedded environments and consumer electronics applications.
  • Design ecosystem – The ECP2 family is documented with on-device resources such as DSP blocks, PLLs/DLLs and configuration options to streamline implementation and debugging.
  • Regulatory compliance – RoHS-compliant construction supports environmentally conscious product design and manufacturing.

Why Choose LFE2-20E-6Q208C?

The LFE2-20E-6Q208C positions itself as a compact, commercially rated FPGA option for designers who need a reliable balance of logic density, embedded memory and flexible I/O in a 208-pin surface-mount package. Its combination of 21,000 logic elements, on-chip RAM and DSP resources makes it well suited for commercial embedded systems, protocol bridging and moderate signal-processing applications.

Available documentation and family-level design resources help accelerate development and system integration, delivering a scalable platform for projects that require proven FPGA capabilities within a commercial temperature and voltage envelope.

Request a quote or submit an inquiry to check availability and pricing for the LFE2-20E-6Q208C.

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