LFE2-20E-6Q208C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 131 282624 21000 208-BFQFP |
|---|---|
| Quantity | 113 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 131 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2625 | Number of Logic Elements/Cells | 21000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFE2-20E-6Q208C – ECP2 FPGA, 21,000 logic elements, 131 I/Os, 208-BFQFP
The LFE2-20E-6Q208C is a commercial-grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor’s ECP2 family. It delivers a balanced combination of programmable logic, embedded memory, DSP capability and flexible I/O in a compact 208-pin BFQFP package for commercial embedded designs.
With 21,000 logic elements, 131 user I/Os and approximately 0.283 Mbits of on-chip RAM, this device is suited to system integration tasks that require moderate logic density, configurable interfaces and on-chip memory within a 0°C to 85°C operating range and RoHS-compliant construction.
Key Features
- Logic Capacity – 21,000 logic elements (cells) for implementing combinational and sequential logic, state machines and glue logic.
- On-chip Memory – 282,624 total RAM bits (approximately 0.283 Mbits) of embedded memory for buffering, FIFOs and small data stores.
- DSP Capability – Family-level sysDSP blocks and multiply/accumulate resources provide hardware-accelerated arithmetic for signal processing tasks.
- Programmable I/O – 131 user I/Os with programmable sysI/O buffers to support a wide range of single-ended and differential signaling standards for interface flexibility.
- Clocking & Timing – Integrated PLLs and DLLs (sysCLOCK) for clock multiplication, division and phase/delay adjustment to support varied clocking schemes.
- Configuration & Security – Flexible device configuration options including SPI boot flash interface and support for dual boot images; family documentation notes optional bitstream encryption on designated series.
- Power & Package – Low-voltage core supply range of 1.14 V to 1.26 V in a 208-pin BFQFP (28 × 28 mm supplier package 208-PQFP) suitable for surface-mount assembly.
- Commercial Grade & Compliance – Rated for 0°C to 85°C operation and RoHS-compliant.
Typical Applications
- Embedded Systems – Implement control logic, protocol bridges and custom peripherals where moderate logic density and flexible I/O are required.
- Signal Processing – Leverage embedded DSP blocks and on-chip RAM for filtering, aggregation and arithmetic-intensive tasks in commercial signal processing designs.
- Memory Interface Controllers – Use dedicated clocking resources and programmable I/O to support DDR/DDR2 memory interfaces and source-synchronous memory designs.
- Interface & Protocol Glue – Implement protocol conversion, parallel-to-serial bridging and custom interface logic using the device’s programmable I/O and logic resources.
Unique Advantages
- Balanced logic and memory – 21,000 logic elements paired with approximately 0.283 Mbits of embedded RAM provide a practical mix for control, buffering and moderate data-path functions.
- Flexible I/O count – 131 user I/Os in a 208-pin BFQFP package simplify board-level routing while supporting multiple interface standards.
- Low-voltage core – Core supply range of 1.14 V to 1.26 V enables integration into low-voltage power architectures common in commercial designs.
- Commercial temperature rating – 0°C to 85°C operation aligns with typical commercial embedded environments and consumer electronics applications.
- Design ecosystem – The ECP2 family is documented with on-device resources such as DSP blocks, PLLs/DLLs and configuration options to streamline implementation and debugging.
- Regulatory compliance – RoHS-compliant construction supports environmentally conscious product design and manufacturing.
Why Choose LFE2-20E-6Q208C?
The LFE2-20E-6Q208C positions itself as a compact, commercially rated FPGA option for designers who need a reliable balance of logic density, embedded memory and flexible I/O in a 208-pin surface-mount package. Its combination of 21,000 logic elements, on-chip RAM and DSP resources makes it well suited for commercial embedded systems, protocol bridging and moderate signal-processing applications.
Available documentation and family-level design resources help accelerate development and system integration, delivering a scalable platform for projects that require proven FPGA capabilities within a commercial temperature and voltage envelope.
Request a quote or submit an inquiry to check availability and pricing for the LFE2-20E-6Q208C.

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