LFE2-20E-6FN672I

The LFE2-20E-6FN672I is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation’s ECP2 family. It provides a balance of programmable logic capacity, on-chip memory, and a high I/O count in a compact 672-ball FBGA package for industrial applications.

Designed for systems that require reconfigurable logic with robust I/O and industrial temperature support, this device delivers integration and flexibility while operating from a low-voltage supply range.

Key Features

• Logic Capacity  Approximately 21,000 logic elements for implementing custom digital logic and control functions.
• Embedded Memory  Approximately 0.283 Mbits (282,624 bits) of on-chip RAM to support data buffering, state machines, and small memory structures.
• I/O Density  402 device I/O pins to accommodate multiple interfaces, sensors, and peripherals without external I/O expanders.
• Power  Core voltage operation from 1.14 V to 1.26 V to match low-voltage system requirements.
• Package & Mounting  672-ball FPBGA (27 × 27 mm) surface-mount package provides a compact footprint for high-density board designs.
• Industrial Temperature Grade  Rated for −40 °C to 100 °C operation to meet industrial-environment thermal requirements.
• Compliance  RoHS-compliant construction for regulatory and environmental requirements.

Typical Applications

• Industrial Control  Use in control systems where industrial temperature operation and rugged, reconfigurable logic are required for motor control, PLC functions, or process automation.
• High-Density I/O Systems  Deploy in applications needing a large number of direct I/O connections, such as data acquisition front ends or multi-channel sensor interfaces.
• Compact Embedded Designs  Suitable for space-constrained boards that need substantial logic and memory in a 672-ball FBGA surface-mount package.
• Low-Voltage FPGA Designs  Ideal for systems designed around low core voltages thanks to a defined supply range of 1.14 V to 1.26 V.

Unique Advantages

• High Logic Integration: 21,000 logic elements enable consolidation of multiple discrete functions into a single programmable device, reducing BOM and board complexity.
• Significant On-Chip Memory: Approximately 0.283 Mbits of embedded RAM provides local storage for buffering and state management without external memory in many use cases.
• Large I/O Count: 402 I/O pins allow direct connection to numerous peripherals and interfaces, simplifying board-level routing and connector requirements.
• Industrial Reliability: −40 °C to 100 °C operating range supports deployment in industrial environments with wide temperature variation.
• Compact, Surface-Mount Package: 672-FPBGA (27×27) package delivers a space-efficient solution for high-density, manufacturable PCB layouts.
• Environmental Compliance: RoHS-compliant construction aligns with environmental and regulatory expectations for modern electronics.

Why Choose LFE2-20E-6FN672I?

The LFE2-20E-6FN672I positions itself as a practical, industrial-grade FPGA choice for designs that require balanced logic density, embedded memory, and substantial I/O in a compact package. Its specified voltage range and wide operating temperature make it suitable for industrial embedded systems and high-density I/O applications.

Backed by Lattice Semiconductor Corporation, this device offers a stable hardware building block for teams seeking a reconfigurable and scalable solution that reduces BOM complexity and supports long-term deployment in industrial environments.

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