LFE2-20E-6QN208C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 131 282624 21000 208-BFQFP |
|---|---|
| Quantity | 191 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 131 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2625 | Number of Logic Elements/Cells | 21000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFE2-20E-6QN208C – ECP2 Field Programmable Gate Array (FPGA) IC 131 282624 21000 208-BFQFP
The LFE2-20E-6QN208C is a commercial-grade Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation in the ECP2 family. It provides a balance of logic density, on-chip memory and I/O in a 208-pin BFQFP surface-mount package for commercial embedded designs.
Key architectural highlights include 21,000 logic elements, approximately 0.28 Mbits of embedded RAM, and 131 available I/Os, all operating from a 1.14 V to 1.26 V supply and specified for 0 °C to 85 °C ambient temperature.
Key Features
- Core Logic 21,000 logic elements provide programmable resources for implementing custom logic, state machines and glue logic in commercial designs.
- Logic Block Count 2,625 logic blocks (listed in device data) to structure and allocate logic resources across designs.
- Embedded Memory Approximately 0.28 Mbits (282,624 bits) of on-chip RAM for buffering, FIFOs and small data storage needs without external memory.
- I/O Capacity 131 I/O pins support a range of peripheral connections and signaling requirements within the package constraints.
- Power Narrow core supply range of 1.14 V to 1.26 V for predictable power planning and board-level power design.
- Package & Mounting 208-BFQFP (supplier device package: 208-PQFP, 28×28 mm) in a surface-mount form factor for standard PCB assembly processes.
- Operating Range & Grade Commercial grade device specified for 0 °C to 85 °C operating temperature.
- Compliance RoHS compliant, supporting lead-free assembly and regulatory requirements for many commercial products.
Typical Applications
- Commercial embedded systems Integration of custom logic and peripheral interfaces where 21,000 logic elements and 131 I/Os meet system partitioning needs.
- On-board data buffering and control Use of approximately 0.28 Mbits of embedded RAM for temporary storage, FIFOs or small data structures without external memory.
- Compact PCB designs Surface-mount 208-BFQFP package suited for space-constrained commercial PCBs requiring a moderate I/O count.
Unique Advantages
- High programmable density: 21,000 logic elements enable consolidation of multiple functions into a single FPGA device.
- On-chip memory available: Approximately 0.28 Mbits of embedded RAM reduces dependence on external memory for small buffers and FIFOs.
- Generous I/O count: 131 I/Os allow flexible interfacing to peripherals and system buses without immediate need for expansion chips.
- Low-voltage core: 1.14 V to 1.26 V supply simplifies power rail planning for modern low-voltage systems.
- Surface-mount packaging: 208-BFQFP (28×28 mm) provides a compact footprint compatible with standard assembly processes.
- Commercial temperature rating: Specified 0 °C to 85 °C for typical commercial product environments.
Why Choose LFE2-20E-6QN208C?
The LFE2-20E-6QN208C positions itself as a practical FPGA option for commercial embedded designs that require a balance of logic capacity, on-chip memory and a substantial I/O count in a compact surface-mount package. Its defined supply and temperature ranges make it straightforward to integrate into commercial product bill-of-materials and thermal designs.
With 21,000 logic elements, approximately 0.28 Mbits of embedded RAM and 131 I/Os in a 208-pin BFQFP, this Lattice Semiconductor device is well suited to engineers seeking moderate-density programmable logic for consolidation of functions, on-board buffering and flexible interfacing in commercial applications.
Request a quote or submit a pricing inquiry today to check availability and lead times for the LFE2-20E-6QN208C.

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