LFE2-20E-6QN208C

IC FPGA 131 I/O 208QFP
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 131 282624 21000 208-BFQFP

Quantity 191 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O131Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2625Number of Logic Elements/Cells21000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFE2-20E-6QN208C – ECP2 Field Programmable Gate Array (FPGA) IC 131 282624 21000 208-BFQFP

The LFE2-20E-6QN208C is a commercial-grade Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation in the ECP2 family. It provides a balance of logic density, on-chip memory and I/O in a 208-pin BFQFP surface-mount package for commercial embedded designs.

Key architectural highlights include 21,000 logic elements, approximately 0.28 Mbits of embedded RAM, and 131 available I/Os, all operating from a 1.14 V to 1.26 V supply and specified for 0 °C to 85 °C ambient temperature.

Key Features

  • Core Logic  21,000 logic elements provide programmable resources for implementing custom logic, state machines and glue logic in commercial designs.
  • Logic Block Count  2,625 logic blocks (listed in device data) to structure and allocate logic resources across designs.
  • Embedded Memory  Approximately 0.28 Mbits (282,624 bits) of on-chip RAM for buffering, FIFOs and small data storage needs without external memory.
  • I/O Capacity  131 I/O pins support a range of peripheral connections and signaling requirements within the package constraints.
  • Power  Narrow core supply range of 1.14 V to 1.26 V for predictable power planning and board-level power design.
  • Package & Mounting  208-BFQFP (supplier device package: 208-PQFP, 28×28 mm) in a surface-mount form factor for standard PCB assembly processes.
  • Operating Range & Grade  Commercial grade device specified for 0 °C to 85 °C operating temperature.
  • Compliance  RoHS compliant, supporting lead-free assembly and regulatory requirements for many commercial products.

Typical Applications

  • Commercial embedded systems  Integration of custom logic and peripheral interfaces where 21,000 logic elements and 131 I/Os meet system partitioning needs.
  • On-board data buffering and control  Use of approximately 0.28 Mbits of embedded RAM for temporary storage, FIFOs or small data structures without external memory.
  • Compact PCB designs  Surface-mount 208-BFQFP package suited for space-constrained commercial PCBs requiring a moderate I/O count.

Unique Advantages

  • High programmable density: 21,000 logic elements enable consolidation of multiple functions into a single FPGA device.
  • On-chip memory available: Approximately 0.28 Mbits of embedded RAM reduces dependence on external memory for small buffers and FIFOs.
  • Generous I/O count: 131 I/Os allow flexible interfacing to peripherals and system buses without immediate need for expansion chips.
  • Low-voltage core: 1.14 V to 1.26 V supply simplifies power rail planning for modern low-voltage systems.
  • Surface-mount packaging: 208-BFQFP (28×28 mm) provides a compact footprint compatible with standard assembly processes.
  • Commercial temperature rating: Specified 0 °C to 85 °C for typical commercial product environments.

Why Choose LFE2-20E-6QN208C?

The LFE2-20E-6QN208C positions itself as a practical FPGA option for commercial embedded designs that require a balance of logic capacity, on-chip memory and a substantial I/O count in a compact surface-mount package. Its defined supply and temperature ranges make it straightforward to integrate into commercial product bill-of-materials and thermal designs.

With 21,000 logic elements, approximately 0.28 Mbits of embedded RAM and 131 I/Os in a 208-pin BFQFP, this Lattice Semiconductor device is well suited to engineers seeking moderate-density programmable logic for consolidation of functions, on-board buffering and flexible interfacing in commercial applications.

Request a quote or submit a pricing inquiry today to check availability and lead times for the LFE2-20E-6QN208C.

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