LFE2-20E-7FN256C

The LFE2-20E-7FN256C is an ECP2 family field programmable gate array (FPGA) from Lattice Semiconductor Corporation supplied in a 256-ball BGA (17×17) surface-mount package. It provides a balanced combination of programmable logic, on-chip RAM, and a large I/O count for commercial embedded designs.

Key device attributes include 21,000 logic elements, approximately 0.28 Mbits of embedded memory (282,624 total RAM bits), 193 user I/Os, low-voltage operation (1.14 V–1.26 V), and a commercial operating range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic 21,000 logic elements provide the programmable fabric for implementing custom digital functions and control logic.
• Embedded Memory Approximately 0.28 Mbits of on-chip RAM (282,624 bits) supports data buffering, FIFOs, and local storage for logic processes.
• I/O Capacity 193 user I/Os enable extensive peripheral interfacing, parallel buses, and multi-signal connectivity within a single device.
• Power Supply Low-voltage core operation from 1.14 V to 1.26 V for compatibility with modern power domains and efficient power budgeting.
• Package & Mounting 256-ball fine-pitch BGA (256-FPBGA, 17×17) in a surface-mount form factor for compact board integration and reliable solder connections.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C, making it suitable for a wide range of commercial and office-environment applications.
• Environmental Compliance RoHS compliant for adherence to current lead-free and restricted-substance requirements.

Typical Applications

• Embedded Control Use the device’s 21,000 logic elements to implement custom control logic and state machines for embedded subsystems.
• I/O Expansion and Bridging With 193 I/Os, the FPGA can act as a bridge or aggregator between multiple peripherals, parallel buses, and sensors.
• On-Chip Data Handling Approximately 0.28 Mbits of embedded RAM supports buffering and local data manipulation for streaming or burst data paths.

Unique Advantages

• Substantial Logic Capacity: 21,000 logic elements provide significant programmable resources for mid-range logic implementation without external ASICs.
• Integrated Memory Resources: 282,624 bits of on-chip RAM reduce the need for external memory in many buffering and data-path applications.
• High I/O Count: 193 user I/Os enable flexible interfacing to multiple peripherals and parallel interfaces from a single package.
• Low-Voltage Core Operation: A 1.14 V–1.26 V supply range supports integration with modern low-voltage power rails and efficient system designs.
• Compact BGA Package: The 256-FPBGA (17×17) surface-mount package allows dense board layouts while maintaining robust solder connections.
• RoHS Compliance: Environmentally compliant construction supports current regulatory and manufacturing requirements.

Why Choose LFE2-20E-7FN256C?

The LFE2-20E-7FN256C positions itself as a programmable logic option for commercial embedded designs that require a balance of logic density, on-chip memory, and a high I/O count in a compact BGA package. Its low-voltage operation and RoHS compliance simplify integration into contemporary system architectures.

This device is well suited for developers and procurement teams seeking a mid-range FPGA offering predictable operating conditions (0 °C to 85 °C) and a substantial set of resources—logic elements, RAM, and I/Os—within a single surface-mount component.

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