LFE2-20E-7FN484C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 331 282624 21000 484-BBGA |
|---|---|
| Quantity | 574 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 331 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2625 | Number of Logic Elements/Cells | 21000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFE2-20E-7FN484C – ECP2 FPGA, 21,000 logic elements, 331 I/Os, 484-BBGA
The LFE2-20E-7FN484C is an ECP2 family Field Programmable Gate Array (FPGA) IC designed for commercial embedded designs requiring a balance of logic density, on-chip memory, and a high I/O count. It integrates 21,000 logic elements and approximately 282,624 bits of embedded RAM to support complex digital functions and buffering on a single device.
Configured in a 484-BBGA (484-FPBGA, 23×23) surface-mount package and operating from a 1.14 V to 1.26 V supply, this device is suitable for a wide range of commercial applications that benefit from flexible, reprogrammable logic and substantial I/O connectivity.
Key Features
- Core Logic 21,000 logic elements provide a flexible fabric for implementing custom digital logic, state machines, and control functions.
- Embedded Memory Approximately 282,624 bits of on-chip RAM for buffering, FIFOs, and small lookup tables within the FPGA fabric.
- I/O Capacity 331 I/Os allow support for wide parallel interfaces, multiple peripherals, and dense external connectivity.
- Power Operates from a 1.14 V to 1.26 V core voltage range to match system power design requirements.
- Package & Mounting 484-BBGA (supplier package: 484-FPBGA, 23×23) in a surface-mount form factor for compact board-level integration.
- Operating Temperature Commercial grade operation from 0 °C to 85 °C for typical commercial environment deployments.
- Regulatory RoHS compliant to meet standard environmental and manufacturing requirements.
Typical Applications
- Commercial Embedded Systems Implement control logic, protocol handling, and glue-logic in compact embedded products using the device's logic density and I/O resources.
- Data Acquisition & Interface Hubs Support multiple sensor and peripheral interfaces with 331 I/Os and on-chip memory for temporary data buffering.
- High-density Digital Processing Use the 21,000 logic elements and embedded RAM to realize custom processing blocks, finite state machines, and parallel datapaths.
Unique Advantages
- High Logic Capacity: 21,000 logic elements enable implementation of significant custom digital functions without external ASICs.
- Substantial On-chip Memory: Approximately 282,624 bits of embedded RAM reduce reliance on external memory for short-term buffering and FIFOs.
- Extensive I/O Count: 331 I/Os simplify board design by accommodating many peripherals and parallel interfaces directly on-chip.
- Compact BGA Footprint: 484-BBGA (484-FPBGA, 23×23) balances board space and thermal considerations for dense PCBs.
- Low-voltage Core: 1.14 V to 1.26 V operation aligns with modern system power rails for efficient integration.
- RoHS Compliant: Meets environmental manufacturing requirements for commercial products.
Why Choose LFE2-20E-7FN484C?
The LFE2-20E-7FN484C positions itself as a versatile commercial FPGA option that combines a substantial logic element count with on-chip RAM and a high number of I/Os in a compact BGA package. It is well suited for designers who need to consolidate digital functions, manage multiple interfaces, and maintain a small board footprint while operating within standard commercial temperature and voltage ranges.
For teams developing commercial embedded products, interface hubs, or high-density digital modules, this device offers a balanced mix of integration and scalability backed by RoHS compliance and surface-mount package convenience.
Request a quote or submit a pricing inquiry today to evaluate the LFE2-20E-7FN484C for your next design.