LFE2-20SE-5F256C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 193 282624 21000 256-BGA |
|---|---|
| Quantity | 737 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 193 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2625 | Number of Logic Elements/Cells | 21000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFE2-20SE-5F256C – ECP2 Field Programmable Gate Array (FPGA) IC 193 282624 21000 256-BGA
The LFE2-20SE-5F256C is an ECP2-series Field Programmable Gate Array from Lattice Semiconductor, delivered in a 256-ball fpBGA (17 × 17 mm) package for surface-mount assembly. This device provides approximately 21,000 logic elements and extensive I/O capability, targeting mid-density FPGA applications that require flexible logic, embedded memory and on-chip DSP resources.
With an operating supply range of 1.14 V to 1.26 V and a commercial temperature rating (0 °C to 85 °C), the part is suited for a wide range of commercial embedded designs where board-level integration, deterministic I/O counts and on-chip memory are required.
Key Features
- FPGA Core Approximately 21,000 logic elements (logic cells) for implementing combinational and sequential logic, state machines and glue logic.
- Embedded Memory Approximately 282,624 bits of on-chip RAM for frame buffers, FIFOs and small data stores.
- DSP Resources Family-level sysDSP resources and dedicated multipliers are provided in the ECP2-20 variant to accelerate arithmetic and signal-processing tasks.
- I/O Density and Flexibility 193 general-purpose I/Os with programmable sysI/O buffer support for a broad set of I/O standards and source-synchronous interfaces.
- Clocking Resources Device-level clock management includes general-purpose PLLs and DLLs as indicated for the ECP2-20 family, enabling flexible clock multiplication, division and phase adjustment.
- Power Operates from a nominal low-voltage core supply in the range 1.14 V to 1.26 V.
- Package & Mounting 256-ball fpBGA (17 × 17 mm) supplier device package, surface-mount mounting type suitable for compact board designs.
- Temperature & Grade Commercial grade with operating temperature range 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- Embedded Control Implements custom control logic, protocol handling and glue logic for commercial embedded systems that require flexible programmable logic.
- Signal Processing Uses on-chip sysDSP blocks and multipliers for acceleration of arithmetic-intensive tasks such as filtering, transforms and fixed-point processing.
- Interface Bridging Provides a compact solution for bridging parallel and serial interfaces where up to 193 I/Os and programmable I/O standards are needed.
- Memory Interfacing Uses embedded RAM and dedicated memory interface features for buffering, packet handling or temporary storage in system designs.
Unique Advantages
- Balanced Logic and Memory Mix: Approximately 21,000 logic elements paired with ~282 Kbits of on-chip RAM supports mid-density designs without extensive external memory.
- High I/O Count in a Compact Package: 193 I/Os in a 256-ball fpBGA (17 × 17 mm) form factor maximizes routing density for small-footprint boards.
- Flexible Clocking: Integrated PLL/DLL clock resources (as specified for the ECP2-20 family) simplify multi-clock domain designs and timing management.
- Commercial-Grade Reliability: Designed for 0 °C to 85 °C operation with surface-mount package compatibility for standard commercial production environments.
- Environmentally Compliant: RoHS compliance supports regulatory and manufacturing requirements for lead-free assembly.
- Supported Design Flow: Part of the Lattice ECP2 family, supported by the family design documentation and tools referenced for ECP2 devices.
Why Choose LFE2-20SE-5F256C?
The LFE2-20SE-5F256C positions itself as a compact, mid-density programmable logic device that balances logic capacity, embedded RAM and I/O resources in a 17 × 17 mm fpBGA package. Its commercial-grade temperature range, low-voltage core operation and RoHS compliance make it a practical choice for OEMs and integrators building cost-conscious, board-level FPGA solutions that need deterministic I/O counts and on-chip DSP/memory resources.
Designers benefit from the ECP2 family feature set and supporting documentation and toolchain to implement complex control, interface and signal-processing functions while keeping BOM complexity and PCB area manageable.
Request a quote or submit an inquiry for pricing and availability to obtain lead-time and ordering information for the LFE2-20SE-5F256C.

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