LFE2-20SE-5F256C

IC FPGA 193 I/O 256FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 193 282624 21000 256-BGA

Quantity 737 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O193Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2625Number of Logic Elements/Cells21000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFE2-20SE-5F256C – ECP2 Field Programmable Gate Array (FPGA) IC 193 282624 21000 256-BGA

The LFE2-20SE-5F256C is an ECP2-series Field Programmable Gate Array from Lattice Semiconductor, delivered in a 256-ball fpBGA (17 × 17 mm) package for surface-mount assembly. This device provides approximately 21,000 logic elements and extensive I/O capability, targeting mid-density FPGA applications that require flexible logic, embedded memory and on-chip DSP resources.

With an operating supply range of 1.14 V to 1.26 V and a commercial temperature rating (0 °C to 85 °C), the part is suited for a wide range of commercial embedded designs where board-level integration, deterministic I/O counts and on-chip memory are required.

Key Features

  • FPGA Core  Approximately 21,000 logic elements (logic cells) for implementing combinational and sequential logic, state machines and glue logic.
  • Embedded Memory  Approximately 282,624 bits of on-chip RAM for frame buffers, FIFOs and small data stores.
  • DSP Resources  Family-level sysDSP resources and dedicated multipliers are provided in the ECP2-20 variant to accelerate arithmetic and signal-processing tasks.
  • I/O Density and Flexibility  193 general-purpose I/Os with programmable sysI/O buffer support for a broad set of I/O standards and source-synchronous interfaces.
  • Clocking Resources  Device-level clock management includes general-purpose PLLs and DLLs as indicated for the ECP2-20 family, enabling flexible clock multiplication, division and phase adjustment.
  • Power  Operates from a nominal low-voltage core supply in the range 1.14 V to 1.26 V.
  • Package & Mounting  256-ball fpBGA (17 × 17 mm) supplier device package, surface-mount mounting type suitable for compact board designs.
  • Temperature & Grade  Commercial grade with operating temperature range 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Embedded Control  Implements custom control logic, protocol handling and glue logic for commercial embedded systems that require flexible programmable logic.
  • Signal Processing  Uses on-chip sysDSP blocks and multipliers for acceleration of arithmetic-intensive tasks such as filtering, transforms and fixed-point processing.
  • Interface Bridging  Provides a compact solution for bridging parallel and serial interfaces where up to 193 I/Os and programmable I/O standards are needed.
  • Memory Interfacing  Uses embedded RAM and dedicated memory interface features for buffering, packet handling or temporary storage in system designs.

Unique Advantages

  • Balanced Logic and Memory Mix:  Approximately 21,000 logic elements paired with ~282 Kbits of on-chip RAM supports mid-density designs without extensive external memory.
  • High I/O Count in a Compact Package:  193 I/Os in a 256-ball fpBGA (17 × 17 mm) form factor maximizes routing density for small-footprint boards.
  • Flexible Clocking:  Integrated PLL/DLL clock resources (as specified for the ECP2-20 family) simplify multi-clock domain designs and timing management.
  • Commercial-Grade Reliability:  Designed for 0 °C to 85 °C operation with surface-mount package compatibility for standard commercial production environments.
  • Environmentally Compliant:  RoHS compliance supports regulatory and manufacturing requirements for lead-free assembly.
  • Supported Design Flow:  Part of the Lattice ECP2 family, supported by the family design documentation and tools referenced for ECP2 devices.

Why Choose LFE2-20SE-5F256C?

The LFE2-20SE-5F256C positions itself as a compact, mid-density programmable logic device that balances logic capacity, embedded RAM and I/O resources in a 17 × 17 mm fpBGA package. Its commercial-grade temperature range, low-voltage core operation and RoHS compliance make it a practical choice for OEMs and integrators building cost-conscious, board-level FPGA solutions that need deterministic I/O counts and on-chip DSP/memory resources.

Designers benefit from the ECP2 family feature set and supporting documentation and toolchain to implement complex control, interface and signal-processing functions while keeping BOM complexity and PCB area manageable.

Request a quote or submit an inquiry for pricing and availability to obtain lead-time and ordering information for the LFE2-20SE-5F256C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up