LFE2-20SE-5F672C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 402 282624 21000 672-BBGA |
|---|---|
| Quantity | 346 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 402 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2625 | Number of Logic Elements/Cells | 21000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFE2-20SE-5F672C – ECP2 Field Programmable Gate Array (FPGA) 672-BBGA
The LFE2-20SE-5F672C is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for mid-range logic integration and high I/O count in a compact BGA package. It combines programmable logic, embedded RAM, and extensive I/O to address designs that require significant connectivity and on-chip memory.
With up to 21,000 logic elements, approximately 0.28 Mbits of embedded memory, and 402 I/O pins, this commercial-grade FPGA targets applications that need balanced compute resources, dense I/O, and low-voltage operation within a 0 °C to 85 °C operating range.
Key Features
- Core Logic Approximately 21,000 logic elements and 2,625 configurable logic blocks provide flexible programmable logic for custom digital functions and glue logic.
- Embedded Memory Approximately 282,624 bits of on-chip RAM for buffering, packet processing, and temporary data storage within the FPGA fabric.
- High I/O Count 402 user I/O pins support dense peripheral interfacing and wide-parallel connections for system-level integration.
- Package and Mounting 672-BBGA (supplier 672-FPBGA, 27 × 27 mm) surface-mount package delivers a compact footprint for space-constrained PCBs.
- Power Low-voltage core supply range from 1.14 V to 1.26 V for integration into low-voltage power domains.
- Operating Range and Grade Commercial grade operation from 0 °C to 85 °C suitable for standard embedded and consumer environments.
- Environmental Compliance RoHS-compliant formulation supports regulatory requirements for lead-free manufacturing.
Typical Applications
- Data and Communications Interfaces — Use the high I/O count and on-chip RAM to implement protocol bridging, packet buffering, and parallel interface logic.
- Embedded Control and Logic Consolidation — Replace multi-IC glue logic with programmable logic for motor control, system sequencing, and custom control functions.
- Consumer and Industrial Electronics — Implement user interfaces, sensor aggregation, and peripheral control where a commercial-grade FPGA is appropriate.
- Test, Measurement, and Prototyping — Rapidly iterate hardware functions and validate algorithms using the FPGA’s reprogrammable fabric and memory resources.
Unique Advantages
- High Logic Density: Approximately 21,000 logic elements enable substantial on-chip digital integration to consolidate multiple functions into a single device.
- Significant Embedded RAM: Around 0.28 Mbits of on-chip memory supports buffering and intermediate data storage without external memory.
- Extensive I/O: 402 I/O pins provide the connectivity needed for wide-parallel buses, multiple peripherals, and complex system interfaces.
- Compact BGA Footprint: 672-BBGA (27 × 27 mm) packaging minimizes board area while maintaining thermal and routing density advantages of BGA mounting.
- Low-Voltage Operation: Narrow core supply range (1.14 V–1.26 V) aligns with modern low-voltage system domains and power budgets.
- RoHS Compliant: Meets lead-free manufacturing requirements for regulatory and assembly compatibility.
Why Choose LFE2-20SE-5F672C?
The LFE2-20SE-5F672C delivers a balanced combination of logic capacity, embedded memory, and extensive I/O in a compact 672-BBGA package, making it well suited to designs that require mid-range programmable logic and high connectivity within commercial temperature environments. Its low-voltage core and RoHS compliance simplify system power and manufacturing considerations.
This FPGA is ideal for engineers and teams looking to consolidate discrete logic, implement custom interfaces, or prototype complex control and data-path functions while relying on a known semiconductor vendor for device supply and documentation.
Request a quote or submit an inquiry to get pricing and availability for the LFE2-20SE-5F672C. Our team can provide lead-time details and support for your design evaluation needs.

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