LFE2-20SE-5FN256C

The LFE2-20SE-5FN256C is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation featuring the ECP2 family designation. It provides a balance of logic capacity, on-chip memory and I/O density in a compact 256-ball BGA package for commercial-grade designs.

With 21,000 logic elements and 193 I/O pins, this device is suited to applications that require moderate logic integration, significant I/O count, and low-voltage core operation within a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic Capacity  Provides 21,000 logic elements to implement medium-density programmable logic and custom digital functions.
• Embedded Memory  Includes approximately 0.28 Mbits of on-chip RAM (282,624 total RAM bits) for buffering, FIFOs and small data storage.
• I/O Density  Offers 193 user I/O pins to support multiple interfaces, parallel connections or mixed-signal front-end routing.
• Power and Core Voltage  Operates from a core voltage range of 1.14 V to 1.26 V, enabling low-voltage digital designs.
• Package and Mounting  Supplied in a 256-BGA package (supplier device package: 256-FPBGA, 17×17) for surface-mount PCB assembly and compact board footprint.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for commercial applications.
• RoHS Compliant  Meets RoHS environmental requirements for lead-free manufacturing.

Typical Applications

• Interface Bridging and Protocol Conversion  Use the device's 193 I/O and programmable logic to implement glue logic, bus bridging or protocol adapters between subsystems.
• Embedded System Control  Deploy the FPGA for control logic, state machines and timing-critical tasks that benefit from 21,000 logic elements and embedded RAM.
• Sensor and I/O Aggregation  Aggregate and preprocess signals from multiple sensors or peripherals, leveraging available I/O and on-chip memory for buffering.

Unique Advantages

• Balanced Logic and Memory:  21,000 logic elements paired with approximately 0.28 Mbits of RAM supports a wide range of medium-complexity designs without external memory.
• High I/O Count:  193 I/O pins enable extensive connectivity for multi-channel interfaces, reducing the need for additional I/O expanders.
• Compact BGA Package:  The 256-BGA (256-FPBGA, 17×17) package delivers a small board footprint while maintaining ample pin density for complex routing.
• Low-Voltage Core:  Core supply between 1.14 V and 1.26 V allows integration into modern low-voltage power architectures.
• Commercial-Grade Suitability:  Rated for 0 °C to 85 °C operation and RoHS compliant, aligning with standard commercial product lifecycles and manufacturing processes.

Why Choose LFE2-20SE-5FN256C?

The LFE2-20SE-5FN256C positions itself as a commercial-grade FPGA option that combines a mid-level logic element count with substantial I/O and embedded memory in a compact BGA footprint. Its low core-voltage operation and RoHS compliance make it a practical choice for designs where board space, I/O flexibility and power efficiency are important.

This device is well suited to embedded designers and system integrators building medium-complexity digital functions, interface logic, or sensor aggregation modules who require predictable performance across the commercial temperature range.

If you would like pricing, availability or to request a quote for LFE2-20SE-5FN256C, please submit a quote request or contact sales for further assistance.