LFE2-20SE-5FN256I

The LFE2-20SE-5FN256I is an industrial-grade ECP2 FPGA in a 256-pin BGA package designed for configurable digital logic implementations. It provides 21,000 logic elements, approximately 0.28 Mbits of embedded RAM, and 193 I/O to address mid-density logic and interfacing requirements in systems that require a wide operating temperature range and surface-mount packaging.

With a nominal supply range of 1.14 V to 1.26 V and an operating temperature from −40 °C to 100 °C, this device targets applications where integrated logic, memory, and plentiful I/O are needed under industrial conditions.

Key Features

• Core Logic — 21,000 logic elements provide substantial programmable logic capacity for mid-density designs.
• Embedded Memory — Total on-chip RAM of 282,624 bits (approximately 0.28 Mbits) for buffering, LUT storage, and small data structures.
• I/O Count — 193 general-purpose I/O pins to support multiple interfaces and parallel signal connections.
• Package & Mounting — 256-BGA package (supplier package: 256-FPBGA, 17 × 17 mm) with surface-mount assembly for compact board integration.
• Power — Low-voltage core operation with a supply range from 1.14 V to 1.26 V.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
• Regulatory Compliance — RoHS-compliant construction.

Typical Applications

• Industrial Control — Implement deterministic control logic and sensor interfacing using 21,000 logic elements and robust I/O while operating across −40 °C to 100 °C.
• Communications & Protocol Bridging — Use the device’s abundant I/O and embedded RAM to handle protocol conversion, parallel interfaces, and custom bus logic.
• Data Acquisition & Instrumentation — Apply the FPGA’s logic resources and on-chip memory for signal preprocessing, data buffering, and real-time monitoring functions.

Unique Advantages

• Balanced Logic Density: 21,000 logic elements provide a mid-level capacity that fits designs requiring substantial yet cost-conscious programmable logic.
• Integrated On-Chip Memory: Approximately 0.28 Mbits of embedded RAM reduces the need for external memory in many buffering and LUT applications.
• High I/O Count: 193 I/O pins enable complex interfacing and parallel connectivity without excessive external glue logic.
• Industrial-Grade Operation: −40 °C to 100 °C operating range supports deployment in equipment exposed to wide temperature swings.
• Compact Surface-Mount Package: 256-BGA (17 × 17 mm) minimizes PCB footprint while maintaining routing density for advanced board layouts.
• RoHS Compliance: Environmentally compliant construction for regulated product assemblies.

Why Choose LFE2-20SE-5FN256I?

The LFE2-20SE-5FN256I combines a practical logic element count, embedded RAM, and a high I/O complement in a compact surface-mount 256-BGA package, targeting engineers who need a reliable mid-density FPGA for industrial applications. Its low-voltage core supply and wide operating temperature range make it suitable for control, interfacing, and data-handling subsystems where board space and environmental robustness matter.

This device is appropriate for designs that require scalable programmable logic with integrated memory and abundant external connectivity, offering a balance of integration and environmental capability to support long-term deployment in industrial installations.

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