LFE2-20SE-5FN672C

The LFE2-20SE-5FN672C is a field programmable gate array (FPGA) in the Lattice ECP2 family designed for mid-range system integration. It provides approximately 21,000 logic elements, roughly 0.283 Mbits of on-chip RAM, and up to 402 user I/Os in a 672-ball FPBGA (27 × 27 mm) package. Targeted at commercial-grade applications, this device delivers a balance of logic density, embedded memory and I/O capacity for embedded processing, interface bridging and signal processing designs.

Key Features

• Core Logic  Approximately 21,000 logic elements support complex combinational and sequential logic implementation for mid-density designs.
• Embedded Memory  Total on-chip RAM of 282,624 bits (approximately 0.283 Mbits) for embedded block and distributed memory use.
• DSP Resources  Family-level configuration for the ECP2-20 indicates sysDSP blocks and dedicated multipliers to accelerate multiply-accumulate workloads (ECP2-20 family configuration applies).
• I/O Capacity  Up to 402 user I/Os available in the 672-FPBGA (27 × 27 mm) package for dense external connectivity and board-level interfacing.
• Clocking and Timing  Multiple on-chip PLLs/DLLs (family architecture provides general-purpose PLL and DLL resources) for clock management and timing control.
• Programmable I/O Standards  Family-level programmable I/O buffer support across a broad set of standards to match common board-level interfaces and signaling requirements.
• Configuration and Security  Flexible device configuration options (including dual boot and SPI boot flash interface at the family level) for field updates and secure deployment where supported.
• Package & Power  Surface-mount 672-ball FPBGA (27 × 27 mm) in tray packaging; specified supply voltage 1.14 V.
• Commercial Temperature  Rated for operation from 0 °C to 85 °C for commercial applications.

Typical Applications

• Embedded signal processing  Use the device’s logic and DSP-oriented resources for mid-range multiply/accumulate and filtering tasks in communication and instrumentation equipment.
• High-density I/O aggregation  Consolidate multiple peripheral and bus interfaces in networking or connectivity modules using the device’s 402 I/Os in the 672-FPBGA package.
• Memory interface and buffering  Implement DDR/SDRAM interfaces and buffering logic leveraging on-chip memory and source-synchronous I/O support described for the ECP2 family.
• Embedded control and prototyping  Ideal for commercial embedded platforms requiring programmable logic for control, protocol handling and system integration.

Unique Advantages

• Balanced mid-range capacity: Combines ~21,000 logic elements with accessible embedded memory to integrate multiple functions on a single device.
• Substantial I/O in a compact package: 402 I/Os in a 672-ball FPBGA (27 × 27 mm) enable dense board-level connectivity without a larger package footprint.
• Embedded memory for on-chip data paths: Approximately 0.283 Mbits of RAM supports local buffering and state storage to reduce external memory dependence.
• Commercial-grade availability: Specified for 0 °C to 85 °C operation and surface-mount package options for standard commercial deployments.
• Flexible configuration options: Family-level configuration features such as SPI boot flash interface and dual-boot image support facilitate field updates and version management.

Why Choose LFE2-20SE-5FN672C?

The LFE2-20SE-5FN672C positions itself as a pragmatic mid-range FPGA option within the ECP2 family—offering a blend of logic density, embedded RAM and substantial I/O count in a 672-FPBGA package. Its specification set suits commercial embedded and communications designs that require on-chip memory, DSP-oriented resources and flexible I/O without moving to a larger device class.

For engineering teams seeking a commercially-rated FPGA that supports integration of control, interface and signal-processing functions while maintaining a compact board footprint, this device delivers predictable specifications and family-level features to simplify system design and deployment.

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