LFE2-20SE-5FN484C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 331 282624 21000 484-BBGA |
|---|---|
| Quantity | 652 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 331 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2625 | Number of Logic Elements/Cells | 21000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFE2-20SE-5FN484C – ECP2 Field Programmable Gate Array (FPGA) IC 331 282624 21000 484-BBGA
The LFE2-20SE-5FN484C is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation in the ECP2 family. It provides a programmable logic fabric with 21,000 logic elements, embedded memory and a large I/O complement, packaged for surface-mount assembly in a 484-BBGA footprint.
Designed for commercial-grade applications, this device combines on-chip resources and high I/O density with low-voltage operation (1.14 V to 1.26 V) and an operating temperature range of 0 °C to 85 °C, making it suited for compact board-level digital designs that require significant programmable logic and connectivity.
Key Features
- Core Logic 21,000 logic elements provide the programmable fabric for implementing custom digital functions and control logic.
- Embedded Memory Approximately 0.28 Mbits of on-chip RAM for buffering, state storage and small data structures within the FPGA.
- I/O Capacity 331 user I/O pins enable extensive external interfacing and signal routing directly to the FPGA.
- Package & Mounting 484-BBGA package (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for compact PCB integration.
- Power Operates from a supply range of 1.14 V to 1.26 V to match low-voltage system rails.
- Temperature & Grade Commercial-grade device rated for 0 °C to 85 °C operation.
- Environmental Compliance RoHS compliant for adherence to common environmental requirements.
Typical Applications
- Custom digital logic and prototyping Use the 21,000 logic elements to implement and iterate bespoke digital functions during development and system integration.
- I/O-intensive interface bridging The 331 I/O pins accommodate multiple parallel interfaces or gateway functions between system components.
- On-chip buffering and small-data storage Approximately 0.28 Mbits of embedded RAM supports local buffering, FIFOs and state retention without external memory.
- Compact board designs The 484-BBGA (23×23) surface-mount package allows high-density placement in space-constrained PCBs.
Unique Advantages
- High logic density: 21,000 logic elements enable implementation of substantial custom logic while keeping design consolidated on a single device.
- Substantial I/O in one package: 331 I/O pins reduce the need for external glue logic when connecting multiple peripherals or interfaces.
- Integrated on-chip memory: Approximately 0.28 Mbits of RAM provides local storage for buffering and control data, simplifying system memory architecture.
- Compact, manufacturable package: 484-BBGA (484-FPBGA, 23×23) surface-mount package supports automated assembly and dense PCB layouts.
- Low-voltage compatibility: Operates at 1.14 V to 1.26 V, aligning with low-voltage system rails and modern digital power domains.
- Commercial temperature rating: Rated for 0 °C to 85 °C operation for mainstream commercial applications.
Why Choose LFE2-20SE-5FN484C?
The LFE2-20SE-5FN484C positions itself as a high-density, I/O-rich FPGA option for commercial designs that require significant programmable logic, embedded RAM and broad interfacing in a compact package. Its combination of 21,000 logic elements, approximately 0.28 Mbits of on-chip memory and 331 I/O pins makes it suitable for board-level systems that need consolidated digital processing and connectivity.
Backed by Lattice Semiconductor Corporation and delivered in a 484-BBGA surface-mount package, this FPGA offers a practical balance of integration, footprint efficiency and manufacturability for engineers and procurement teams targeting commercial-grade deployments.
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