LFE2-20SE-5F256I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 193 282624 21000 256-BGA |
|---|---|
| Quantity | 400 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 193 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2625 | Number of Logic Elements/Cells | 21000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFE2-20SE-5F256I – ECP2 FPGA, 256-BGA, 193 I/Os
The LFE2-20SE-5F256I is an ECP2 field programmable gate array (FPGA) IC from Lattice Semiconductor offering 21,000 logic elements and approximately 0.283 Mbits of embedded memory (282,624 total RAM bits). It provides 193 user I/Os in a 256-BGA package with a 256-FPBGA (17×17) supplier device package and surface-mount assembly.
Designed for industrial use, the device supports a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, with RoHS compliance for environmental requirements.
Key Features
- Core Capacity — 21,000 logic elements to implement custom digital logic and glue logic functions.
- Embedded Memory — Approximately 0.283 Mbits of on-chip RAM (282,624 bits) for buffering, state storage, and small data structures.
- I/O Density — 193 general-purpose I/Os to support multi-channel interfacing and parallel connectivity.
- Power — Low-voltage operation with a supply range of 1.14 V to 1.26 V to match modern low-voltage systems.
- Package & Mounting — 256-BGA package (supplier device package: 256-FPBGA 17×17) with surface-mount construction for compact PCB layouts.
- Industrial Temperature Range — Rated for −40 °C to 100 °C operation for deployment in temperature-challenging environments.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Industrial Systems — Suitable for industrial deployments that require an industrial temperature range and robust I/O capability.
- Embedded Processing — Useful where programmable logic and on-chip RAM are needed to implement custom logic functions within constrained board space.
- I/O-Intensive Interfaces — The 193 I/Os and compact 256-BGA package support dense interface requirements on space-limited PCBs.
Unique Advantages
- Balanced Logic and Memory — 21,000 logic elements paired with ~0.283 Mbits of embedded RAM enables a broad range of mid-density designs without off-chip memory for small datasets.
- High I/O Count — 193 I/Os reduce the need for external multiplexing or additional interface chips in I/O-heavy designs.
- Compact Packaging — 256-FPBGA (17×17) package provides high pin density in a compact footprint for space-constrained assemblies.
- Industrial Temperature Capability — −40 °C to 100 °C rating supports operation in harsher environments common in industrial applications.
- Low-Voltage Operation — 1.14 V to 1.26 V supply range facilitates integration into modern low-voltage power domains.
- RoHS Compliance — Conforms to environmental regulations for lead-free manufacturing processes.
Why Choose LFE2-20SE-5F256I?
The LFE2-20SE-5F256I delivers a practical balance of logic capacity, embedded memory, and high I/O count in a compact 256-BGA package, geared toward industrial and embedded designs that require programmable logic with robust environmental tolerance. Its low-voltage supply and RoHS compliance make it suitable for modern, regulated product platforms.
This FPGA is well suited for engineers and procurement teams looking for a mid-density, industrial-grade programmable device that supports dense I/O requirements and on-chip memory within a small PCB footprint.
Request a quote or submit an inquiry to receive pricing and availability information for the LFE2-20SE-5F256I.

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