LFE2-20E-7FN672C

The LFE2-20E-7FN672C is an ECP2-series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It combines a mid-range logic capacity with on-chip memory and extensive I/O to support custom digital logic implementations.

Key attributes include 21,000 logic elements, 282,624 bits of embedded RAM (approximately 0.283 Mbits), 402 I/O pins, a 672-BBGA surface-mount package, low-voltage operation (1.14 V to 1.26 V), and a commercial operating range of 0 °C to 85 °C.

Key Features

• Core Logic  21,000 logic elements to implement custom digital state machines, datapaths, and glue logic in a mid-range FPGA footprint.
• Embedded Memory  282,624 bits of on-chip RAM (approximately 0.283 Mbits) for buffering, FIFOs, and small data structures without external memory.
• I/O Density  402 I/O pins provide broad external connectivity options for parallel interfaces and multiple peripherals.
• Power  Low-voltage core supply specified from 1.14 V to 1.26 V to match system power-rail constraints.
• Package & Mounting  672-BBGA package (supplier package: 672-FPBGA, 27×27) designed for surface-mount assembly in compact board layouts.
• Operating Range & Grade  Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Custom Logic and Prototyping  Use the 21,000 logic elements to implement and validate custom digital functions and state machines on prototype and production boards.
• I/O-Intensive Interfaces  Leverage 402 I/O pins to connect multiple peripherals, parallel buses, or high-density connectors without external multiplexing.
• On-Chip Memory Tasks  Employ approximately 0.283 Mbits of embedded RAM for small buffers, FIFOs, and local data storage to reduce external memory dependence.
• Compact Surface-Mount Designs  The 672-BBGA (27×27) package supports compact PCB layouts where board real estate and a surface-mount assembly process are required.

Unique Advantages

• Balanced Logic Capacity: 21,000 logic elements provide a strong balance between capability and cost for mid-range FPGA tasks.
• High I/O Count: 402 I/O pins simplify system integration by accommodating multiple external interfaces directly.
• Integrated On-Chip Memory: 282,624 bits of RAM (≈0.283 Mbits) reduce the need for external memory for many buffering and control tasks.
• Low-Voltage Operation: Core supply range of 1.14 V to 1.26 V aligns with contemporary low-voltage system rails.
• Compact, Surface-Mount Package: 672-BBGA (672-FPBGA, 27×27) enables dense PCB designs while supporting standard surface-mount assembly.
• Regulatory Readiness: RoHS compliance supports environmentally conscious manufacturing processes.

Why Choose LFE2-20E-7FN672C?

The LFE2-20E-7FN672C positions itself as a commercially graded FPGA option that combines 21,000 logic elements, on-chip memory, and a high I/O count in a compact 672-BBGA surface-mount package. Its low-voltage core supply and RoHS compliance make it suitable for modern electronic systems where board integration and regulatory considerations matter.

This device is well suited for engineers and designers seeking a mid-range FPGA that delivers balanced logic capacity, substantial I/O, and embedded RAM for implementing custom digital logic without relying heavily on external components.

Request a quote or submit an inquiry to receive pricing and availability for the LFE2-20E-7FN672C. Our team can provide lead-time information and ordering details.