LFE2-20E-7Q208C

IC FPGA 131 I/O 208QFP
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 131 282624 21000 208-BFQFP

Quantity 1,835 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O131Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2625Number of Logic Elements/Cells21000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFE2-20E-7Q208C – ECP2 Field Programmable Gate Array (FPGA), 21,000 logic elements, 208-BFQFP

The LFE2-20E-7Q208C is an ECP2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation offered in a 208-BFQFP package. It provides a combination of logic capacity, embedded memory, and I/O resources in a commercial-grade, surface-mount package for general-purpose FPGA designs.

Key device attributes include 21,000 logic elements, approximately 0.283 Mbits of on-chip RAM (282,624 bits), 131 I/O pins, a nominal core supply range of 1.14 V to 1.26 V, and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

  • Logic Capacity 21,000 logic elements provide substantial programmable fabric for implementing combinational and sequential logic.
  • Embedded Memory Approximately 0.283 Mbits of on-chip RAM (282,624 bits) for data buffering, FIFOs, and small lookup tables.
  • I/O Resources 131 user I/O pins enable connecting multiple peripherals, interfaces, and external devices directly to the FPGA.
  • Power Supply Core voltage operating range of 1.14 V to 1.26 V for compatible power-rail designs.
  • Package and Mounting 208-BFQFP package (supplier device package: 208-PQFP (28x28)) in a surface-mount form factor for PCB assembly.
  • Operating Temperature Commercial grade operation from 0 °C to 85 °C for standard temperature environments.
  • Environmental Compliance RoHS compliant to support regulatory requirements for lead-free manufacturing.

Unique Advantages

  • Substantial programmable fabric: 21,000 logic elements allow implementation of mid-density logic designs without external glue logic.
  • On-chip memory available: Approximately 0.283 Mbits of embedded RAM reduces the need for external memory for small buffering and lookup needs.
  • Generous I/O count: 131 I/Os provide flexibility for interfacing multiple sensors, peripherals, or parallel busses.
  • Compact surface-mount package: 208-BFQFP (208-PQFP, 28x28) supports standard PCB assembly flows and enables dense board layouts.
  • Commercial temperature rating: 0 °C to 85 °C suits typical commercial embedded and industrial-adjacent applications.
  • RoHS compliant: Supports lead-free manufacturing requirements and environmental compliance goals.

Why Choose LFE2-20E-7Q208C?

The LFE2-20E-7Q208C positions itself as a commercial-grade, mid-density FPGA solution that balances programmable logic, embedded RAM, and a high I/O count in a surface-mount 208-pin package. Its specified core voltage range and operating temperature make it straightforward to integrate into designs targeting standard commercial environments.

This device is well suited for designers and procurement teams seeking a RoHS-compliant FPGA with clear, verifiable specifications for logic capacity, memory, and I/O resources. Its package and electrical parameters support common PCB assembly and power-rail architectures, providing a predictable platform for scalable FPGA-based designs.

Request a quote or submit a purchase inquiry today to check availability and pricing for the LFE2-20E-7Q208C.

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