LFE2-20E-7F256C

The LFE2-20E-7F256C is an ECP2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation offered in a 256-pin BGA package. It provides programmable logic resources with 21,000 logic elements, approximately 0.28 Mbits of embedded memory, and 193 I/O pins for commercial designs requiring on-chip logic and interfacing.

Designed for surface-mount integration, this device operates from a defined core supply range of 1.14 V to 1.26 V and is rated for commercial temperature use from 0 °C to 85 °C. The 256-FPBGA (17×17) package enables compact, high-density board layouts while maintaining RoHS compliance.

Key Features

• Core & Logic 21,000 logic elements for implementing complex combinational and sequential logic functions within a single FPGA device.
• Embedded Memory Approximately 0.28 Mbits of on-chip RAM to support state storage, buffering, and small data structures without external memory.
• I/O Capacity 193 user I/O pins to connect multiple peripherals, sensors, and high-density signaling requirements.
• Power Core supply voltage specified at 1.14 V to 1.26 V for predictable power budgeting and system integration.
• Package & Mounting 256-FPBGA (17×17) package in a surface-mount form factor for compact, high-density PCB designs.
• Operating Range & Compliance Commercial grade operation from 0 °C to 85 °C and RoHS-compliant for lead-free manufacturing.

Typical Applications

• Commercial embedded systems — Use the FPGA’s logic capacity and on-chip memory to implement custom control, signal processing, or glue logic in commercial products.
• High-density I/O designs — The 193 I/O pins and BGA package support compact boards requiring multiple interfaces and peripheral connections.
• Compact programmable logic integration — Fit substantial programmable logic into space-constrained designs using the 256-FPBGA (17×17) surface-mount package.

Unique Advantages

• Substantial programmable logic capacity: 21,000 logic elements provide the resources needed for mid-range logic implementations without external CPLDs or additional FPGAs.
• On-chip memory: Approximately 0.28 Mbits of embedded RAM reduces dependence on external memory for small buffers and state machines.
• High I/O count: 193 I/O pins simplify routing to multiple peripherals and interfaces, reducing the need for I/O expanders.
• Compact BGA footprint: The 256-FPBGA (17×17) enables high-density PCB layouts while supporting surface-mount assembly processes.
• Defined power envelope: The 1.14 V to 1.26 V core supply range allows straightforward power supply design and sequencing for commercial deployments.
• RoHS compliant: Meets RoHS requirements for lead-free manufacturing and supply-chain compliance.

Why Choose LFE2-20E-7F256C?

The LFE2-20E-7F256C balances significant programmable logic resources, embedded memory, and a high I/O count in a compact 256-BGA surface-mount package suitable for commercial applications. Its defined core voltage range and commercial temperature rating make it straightforward to integrate into systems where predictable power and thermal behavior are required.

This FPGA is well suited to designers and procurement teams looking for a mid-range, commercially graded programmable logic device that supports dense I/O and compact board layouts while remaining RoHS compliant.

Request a quote or submit an RFQ for the LFE2-20E-7F256C to receive pricing and availability information for your project needs.