LFE2-20E-6QN208I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 131 282624 21000 208-BFQFP |
|---|---|
| Quantity | 548 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 131 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2625 | Number of Logic Elements/Cells | 21000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFE2-20E-6QN208I – ECP2 Field Programmable Gate Array (FPGA), 208-BFQFP
The LFE2-20E-6QN208I is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides on-chip logic resources, embedded memory, and a substantial I/O count in a 208-pin BFQFP package targeted for industrial applications.
Key attributes include approximately 21,000 logic elements, roughly 0.28 Mbits of embedded RAM, 131 I/O pins, and a specified operating range from -40 °C to 100 °C. The device is RoHS compliant and is supplied in a surface-mount 208-PQFP (28×28) package.
Key Features
- Logic Capacity — Approximately 21,000 logic elements and 2,625 logic blocks provide substantial programmable logic for glue logic, protocol handling, and custom digital functions.
- Embedded Memory — Approximately 0.28 Mbits of on-chip RAM to support buffering, small lookup tables, and local data storage without external memory.
- I/O Density — 131 general-purpose I/O pins for connectivity to peripherals, sensors, and external devices.
- Power — Core voltage supply specified at 1.14 V to 1.26 V for the device core.
- Package & Mounting — 208-BFQFP package case; supplier device package 208-PQFP (28×28). Surface-mount mounting type suitable for standard PCB assembly.
- Temperature Range & Grade — Industrial grade device with an operating temperature range of -40 °C to 100 °C for deployment in commercial and industrial environments.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Industrial Control — Use the FPGA’s logic and I/O count to implement control logic, signal conditioning interfaces, and real-time decision functions within industrial systems.
- Custom I/O and Glue Logic — Leverage 131 I/O and ~21,000 logic elements to bridge disparate interfaces and implement board-level protocol adaptation.
- Embedded Data Handling — Employ the on-chip RAM (approx. 0.28 Mbits) for packet buffering, small data queues, and lookup tables in embedded processing flows.
Unique Advantages
- Balanced Logic and Memory: The combination of ~21,000 logic elements and ~0.28 Mbits of embedded RAM supports complex custom logic with local storage without immediate need for external memory.
- High I/O Count: 131 I/O pins enable flexible board-level interfacing and integration with multiple peripherals or sensors.
- Industrial-ready Temperature Range: Rated from -40 °C to 100 °C to meet deployment needs in industrial and harsh-environment applications.
- Compact Surface-Mount Package: 208-BFQFP (supplier 208-PQFP 28×28) supports standard PCB assembly processes while providing a high pin count.
- Regulatory Compliance: RoHS compliance simplifies environmental regulatory considerations during product development and manufacturing.
Why Choose LFE2-20E-6QN208I?
The LFE2-20E-6QN208I positions itself as a practical FPGA option for engineers seeking a balance of programmable logic, embedded memory, and a substantial I/O complement in an industrial-grade package. Its specified core voltage, operating temperature range, and surface-mount 208-pin package make it suitable for a wide range of embedded and industrial designs where on-chip resources reduce external BOM and simplify board-level integration.
Designed for teams that need predictable hardware resources and environmental robustness, this FPGA is appropriate for applications requiring custom digital functions, protocol bridging, and localized data buffering. Its RoHS compliance and common PQFP form factor support streamlined manufacturing and regulatory alignment.
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