LFE2-20E-6FN672C

The LFE2-20E-6FN672C is a field programmable gate array (FPGA) IC from Lattice Semiconductor designed for commercial applications. It provides a mid-range FPGA fabric with 21,000 logic elements, 282,624 bits of on-chip RAM, and a high I/O count in a 672-ball BGA package.

This device targets designs that require a balance of logic capacity, embedded memory, and dense I/O, while operating at low core voltages and within a commercial temperature range.

Key Features

• Core Logic 21,000 logic elements (LEs) for implementing custom digital logic and glue-logic functions.
• Embedded Memory 282,624 total RAM bits (approximately 0.28 Mbits) for on-chip buffering, FIFOs, and small data stores.
• I/O Density 402 user I/O pins to support high-pin-count interfacing and multi-channel connectivity.
• Power Core supply voltage range of 1.14 V to 1.26 V to match low-voltage system power rails.
• Package and Mounting 672-ball FPBGA package (27 × 27 mm) in a 672-BBGA footprint, supplied for surface-mount PCB assembly.
• Operating Range and Grade Commercial grade device specified for 0°C to 85°C operation.
• Compliance RoHS compliant material status for regulatory and manufacturing processes.

Typical Applications

• Interface Bridging and Protocol Conversion Use the high I/O count and programmable logic to implement custom protocol translators and data multiplexing.
• Embedded Control Logic Implement control state machines, timing logic, and peripheral controllers using the available logic elements and on-chip RAM.
• Signal Aggregation and Preprocessing Aggregate multiple input streams and perform preprocessing or packet buffering using the embedded RAM and parallel I/O.

Unique Advantages

• Balanced Logic and Memory: 21,000 logic elements combined with 282,624 RAM bits allow both complex logic and local data storage on a single device.
• High I/O Count: 402 I/O pins provide flexibility for multi-channel interfaces and dense board-level connectivity, reducing the need for additional interface ICs.
• Low-Voltage Core Operation: Supports a 1.14 V to 1.26 V core supply range to align with modern low-voltage system designs.
• Compact, Surface-Mount Package: 672-ball FPBGA (27 × 27 mm) package delivers high integration in a surface-mount form factor suitable for compact PCBs.
• Commercial Temperature Rating: Specified for 0°C to 85°C operation to match a wide range of commercial and industrial-adjacent applications.
• RoHS Compliance: RoHS status supports environmentally conscious manufacturing and regulatory compliance.

Why Choose LFE2-20E-6FN672C?

The LFE2-20E-6FN672C offers a practical combination of logic capacity, embedded memory, and extensive I/O in a single commercial-grade FPGA. Its low-voltage core and compact 672-ball FPBGA package make it suitable for space-constrained PCBs that require substantial programmable logic and connectivity.

This device is well suited to engineers and teams building interface-centric designs, embedded control functions, or multi-channel preprocessing systems who need an integrated, RoHS-compliant FPGA with clearly specified electrical and thermal ranges.

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