LFE2-20E-6FN256I

IC FPGA 193 I/O 256FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 193 282624 21000 256-BGA

Quantity 1,364 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O193Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2625Number of Logic Elements/Cells21000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFE2-20E-6FN256I – ECP2 FPGA, 193 I/Os, 21,000 logic elements, 256‑BGA

The LFE2-20E-6FN256I is an industrial‑grade Field Programmable Gate Array (FPGA) in the Lattice ECP2 family designed for integration into space‑constrained boards and systems. Built around a mid‑density logic fabric, this device delivers 21,000 logic elements, a high I/O count and on‑chip RAM to address control, interface and signal‑processing tasks in industrial and embedded applications.

With a low core voltage range and extended operating temperature, the LFE2-20E-6FN256I is aimed at designs that require reliable operation across harsh environments while keeping board area and BOM complexity down.

Key Features

  • Logic Capacity  Provides 21,000 logic elements for combinational and sequential logic implementation and mid‑range integration of control and glue logic on a single device.
  • Embedded Memory  Includes 282,624 bits of on‑chip RAM — approximately 0.283 Mbits — suitable for buffering, small FIFOs, and local state storage.
  • High I/O Count  Offers 193 user I/Os to support wide parallel interfaces, peripheral bridging, and dense board‑level connectivity.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial and ruggedized environments.
  • Low‑Voltage Core  Operates from a 1.14 V to 1.26 V supply, compatible with modern low‑voltage power rails and system power budgeting.
  • Compact Package  Supplied in a 256‑ball fpBGA package (256‑FPBGA, 17×17 mm) optimized for surface‑mount assembly and compact board layouts.
  • Mounting & Compliance  Surface‑mount package with RoHS compliance to meet common environmental and manufacturability requirements.
  • Family‑Level Capabilities  The ECP2 family includes enhanced DSP resources, flexible embedded memory structures and programmable I/O standards support, enabling efficient implementation of signal processing and mixed‑interface designs.

Typical Applications

  • Industrial Control & Automation  Implements motor control logic, deterministic I/O handling and protocol bridging in industrial equipment thanks to its industrial temperature rating and rich I/O count.
  • Embedded Interfaces & Bridge Logic  Consolidates parallel and serial peripherals, acting as a protocol translator or glue logic element between controllers and sensors or actuators.
  • Data Acquisition & Signal Processing  Supports local data buffering and processing tasks where mid‑range logic and on‑chip RAM are required for filtering, decimation, or aggregation.
  • Compact, High‑Density Boards  The 256‑ball fpBGA package and surface‑mount profile make this device suitable for space‑constrained embedded platforms and mezzanine cards.

Unique Advantages

  • Balanced Integration:  Combines 21,000 logic elements with on‑chip RAM and a high I/O count to reduce external glue logic and simplify bill of materials.
  • Industrial Reliability:  Rated −40 °C to 100 °C for sustained operation in industrial temperature environments, helping designs meet field‑use requirements.
  • Low‑Voltage Operation:  1.14 V to 1.26 V core supply reduces power delivery complexity for modern low‑voltage systems.
  • Compact, Assembly‑Friendly Package:  256‑FPBGA (17×17 mm) balances I/O density with a small board footprint for compact systems.
  • RoHS Compliant:  Meets common environmental requirements to support regulated manufacturing and deployment.
  • Family Ecosystem:  Leverages the ECP2 family’s DSP and memory architecture for designs that may scale across other family members.

Why Choose LFE2-20E-6FN256I?

The LFE2-20E-6FN256I positions itself as a mid‑density, industrial‑grade FPGA choice for engineers who need a balance of logic capacity, significant I/O, and on‑chip memory in a compact BGA package. Its low‑voltage core and extended operating temperature make it suitable for embedded and industrial designs where reliability and board space matter.

Design teams looking to consolidate peripheral logic, implement moderate signal processing, or create flexible interface bridges will find this device a practical option that benefits from the broader ECP2 family architecture and deployment‑focused features.

Request a quote or submit an inquiry for pricing and availability of the LFE2-20E-6FN256I to move your design from evaluation to production.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up