LFE2-20E-6FN256I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 193 282624 21000 256-BGA |
|---|---|
| Quantity | 1,364 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 193 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2625 | Number of Logic Elements/Cells | 21000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFE2-20E-6FN256I – ECP2 FPGA, 193 I/Os, 21,000 logic elements, 256‑BGA
The LFE2-20E-6FN256I is an industrial‑grade Field Programmable Gate Array (FPGA) in the Lattice ECP2 family designed for integration into space‑constrained boards and systems. Built around a mid‑density logic fabric, this device delivers 21,000 logic elements, a high I/O count and on‑chip RAM to address control, interface and signal‑processing tasks in industrial and embedded applications.
With a low core voltage range and extended operating temperature, the LFE2-20E-6FN256I is aimed at designs that require reliable operation across harsh environments while keeping board area and BOM complexity down.
Key Features
- Logic Capacity Provides 21,000 logic elements for combinational and sequential logic implementation and mid‑range integration of control and glue logic on a single device.
- Embedded Memory Includes 282,624 bits of on‑chip RAM — approximately 0.283 Mbits — suitable for buffering, small FIFOs, and local state storage.
- High I/O Count Offers 193 user I/Os to support wide parallel interfaces, peripheral bridging, and dense board‑level connectivity.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C for deployment in industrial and ruggedized environments.
- Low‑Voltage Core Operates from a 1.14 V to 1.26 V supply, compatible with modern low‑voltage power rails and system power budgeting.
- Compact Package Supplied in a 256‑ball fpBGA package (256‑FPBGA, 17×17 mm) optimized for surface‑mount assembly and compact board layouts.
- Mounting & Compliance Surface‑mount package with RoHS compliance to meet common environmental and manufacturability requirements.
- Family‑Level Capabilities The ECP2 family includes enhanced DSP resources, flexible embedded memory structures and programmable I/O standards support, enabling efficient implementation of signal processing and mixed‑interface designs.
Typical Applications
- Industrial Control & Automation Implements motor control logic, deterministic I/O handling and protocol bridging in industrial equipment thanks to its industrial temperature rating and rich I/O count.
- Embedded Interfaces & Bridge Logic Consolidates parallel and serial peripherals, acting as a protocol translator or glue logic element between controllers and sensors or actuators.
- Data Acquisition & Signal Processing Supports local data buffering and processing tasks where mid‑range logic and on‑chip RAM are required for filtering, decimation, or aggregation.
- Compact, High‑Density Boards The 256‑ball fpBGA package and surface‑mount profile make this device suitable for space‑constrained embedded platforms and mezzanine cards.
Unique Advantages
- Balanced Integration: Combines 21,000 logic elements with on‑chip RAM and a high I/O count to reduce external glue logic and simplify bill of materials.
- Industrial Reliability: Rated −40 °C to 100 °C for sustained operation in industrial temperature environments, helping designs meet field‑use requirements.
- Low‑Voltage Operation: 1.14 V to 1.26 V core supply reduces power delivery complexity for modern low‑voltage systems.
- Compact, Assembly‑Friendly Package: 256‑FPBGA (17×17 mm) balances I/O density with a small board footprint for compact systems.
- RoHS Compliant: Meets common environmental requirements to support regulated manufacturing and deployment.
- Family Ecosystem: Leverages the ECP2 family’s DSP and memory architecture for designs that may scale across other family members.
Why Choose LFE2-20E-6FN256I?
The LFE2-20E-6FN256I positions itself as a mid‑density, industrial‑grade FPGA choice for engineers who need a balance of logic capacity, significant I/O, and on‑chip memory in a compact BGA package. Its low‑voltage core and extended operating temperature make it suitable for embedded and industrial designs where reliability and board space matter.
Design teams looking to consolidate peripheral logic, implement moderate signal processing, or create flexible interface bridges will find this device a practical option that benefits from the broader ECP2 family architecture and deployment‑focused features.
Request a quote or submit an inquiry for pricing and availability of the LFE2-20E-6FN256I to move your design from evaluation to production.