LFE2-20E-6F672I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 402 282624 21000 672-BBGA |
|---|---|
| Quantity | 1,471 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 402 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2625 | Number of Logic Elements/Cells | 21000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFE2-20E-6F672I – ECP2 Field Programmable Gate Array (FPGA) IC 402 282624 21000 672-BBGA
The LFE2-20E-6F672I is an industrial-grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation's ECP2 family. It provides a mid-range logic capacity with a balance of on-chip memory and extensive I/O for embedded and industrial designs.
Key hardware attributes include 21,000 logic elements, approximately 0.28 Mbits of embedded memory, up to 402 I/O pins, a 672-ball BGA package, and a core supply range of 1.14 V to 1.26 V. The device is intended for surface-mount assembly and rated for operation from −40 °C to 100 °C.
Key Features
- Core Logic 21,000 logic elements provide programmable fabric capacity for mid-range logic integration and custom hardware acceleration.
- Embedded Memory Approximately 0.28 Mbits of on-chip RAM to support buffers, FIFOs, state machines, and small data stores without external memory.
- I/O Density Up to 402 general-purpose I/O pins to support parallel interfaces, multiple serial endpoints, and broad peripheral connectivity.
- Package and Mounting 672-ball BGA package (supplier package: 672-FPBGA, 27 × 27 mm) designed for surface-mount PCB assembly and compact system footprints.
- Power Core supply range of 1.14 V to 1.26 V to match modern low-voltage power domains.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial environments requiring extended temperature capability.
- Regulatory Compliance RoHS-compliant construction for reduced hazardous material content in manufacturing and deployment.
Typical Applications
- Industrial Control and Automation Use the FPGA's 21,000 logic elements and wide I/O count to implement custom control logic, sensor aggregation, and deterministic signal processing in industrial systems.
- Embedded System Integration On-chip RAM and extensive I/O support common embedded functions such as protocol bridging, peripheral aggregation, and custom accelerators.
- Communication Interfaces High I/O density makes the device suitable for implementing parallel or multi-channel serial interfaces and glue logic between subsystems.
Unique Advantages
- Balanced Logic and Memory: 21,000 logic elements paired with approximately 0.28 Mbits of embedded RAM enable a wide range of mid-range designs without immediate reliance on external memory.
- High I/O Count: 402 I/O pins reduce the need for external multiplexing, simplifying board-level design and lowering BOM complexity for multi-interface applications.
- Industrial Reliability: −40 °C to 100 °C operating range supports deployment in demanding industrial environments.
- Compact Surface-Mount Package: 672-ball FPBGA (27 × 27 mm) provides a high-density solution that conserves PCB area while delivering extensive connectivity.
- Low-Voltage Core: 1.14–1.26 V core supply aligns with modern low-power system architectures and power domains.
- RoHS Compliant: Environmentally conscious manufacturing compliance for global production requirements.
Why Choose LFE2-20E-6F672I?
The LFE2-20E-6F672I delivers a practical combination of programmable logic capacity, embedded memory, and high I/O density in a compact BGA package, tailored for industrial and embedded applications. Its specified operating temperature range and RoHS compliance make it a reliable choice for long-life deployments where environmental robustness and regulatory conformance matter.
This FPGA is well suited for designers who need mid-range programmable logic with substantial I/O and on-chip memory for protocol handling, control logic, and integration tasks, backed by Lattice Semiconductor Corporation's ECP2 family heritage.
Request a quote or submit an inquiry to receive pricing and availability information for LFE2-20E-6F672I and to discuss suitability for your design requirements.

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