LFE2-20E-6FN484I

IC FPGA 331 I/O 484FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 331 282624 21000 484-BBGA

Quantity 337 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O331Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2625Number of Logic Elements/Cells21000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFE2-20E-6FN484I – ECP2 FPGA, 484-BBGA, 21,000 Logic Elements

The LFE2-20E-6FN484I is an ECP2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides 21,000 logic elements, approximately 0.28 Mbits of embedded memory, and 331 user I/Os in a 484-ball BGA package.

Designed for industrial-grade applications, this device supports a low-voltage core supply (1.14 V to 1.26 V) and an extended operating temperature range of -40 °C to 100 °C, making it appropriate for systems that require substantial I/O count and on-chip memory in a compact surface-mount form factor.

Key Features

  • Core Logic 21,000 logic elements provide the programmable fabric for implementing custom digital logic, state machines, and peripheral glue logic.
  • Embedded Memory Approximately 0.28 Mbits of on-chip RAM for buffering, FIFOs, and small data structures without external memory components.
  • I/O Density 331 user I/Os support extensive interfacing to peripherals, sensors, and external devices in a single device.
  • Power Low-voltage core operation with a supply range of 1.14 V to 1.26 V to match modern low-voltage system rails.
  • Package & Mounting 484-ball BGA (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for high-density board designs.
  • Industrial Temperature Range Rated for operation from -40 °C to 100 °C to meet industrial environmental requirements.
  • Regulatory Compliance RoHS compliant for use in assemblies requiring lead-free, environmentally compliant components.

Unique Advantages

  • Balanced integration: Combines a substantial logic element count with on-chip RAM and high I/O count to reduce external components and simplify system design.
  • High I/O capacity: 331 I/Os enable complex interfacing and multiple concurrent peripheral connections from a single FPGA footprint.
  • Compact BGA footprint: 484-ball FPBGA (23×23) packaging delivers high pin density in a compact surface-mount form, helping save PCB area.
  • Industrial operating range: -40 °C to 100 °C rating supports deployment in temperature-challenging environments.
  • Low-voltage operation: 1.14 V to 1.26 V core supply aligns with modern low-voltage system power domains for efficient integration.
  • RoHS compliant: Facilitates inclusion in lead-free and environmentally constrained designs.

Why Choose LFE2-20E-6FN484I?

The LFE2-20E-6FN484I is positioned for designs that require a mid-range FPGA with significant I/O capability, on-chip memory, and industrial temperature operation. Its combination of 21,000 logic elements, substantial I/O count, and compact 484-BBGA package makes it suitable for embedded control, interface consolidation, and systems where board space and integration matter.

For engineering teams seeking a RoHS-compliant, surface-mount FPGA with predictable low-voltage operation and extended temperature range, this device delivers a balanced mix of integration and robustness while simplifying BOM and PCB layout decisions.

Request a quote or submit an inquiry to receive pricing, availability, and additional procurement details for the LFE2-20E-6FN484I.

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