LFE2-20E-6F672C

The LFE2-20E-6F672C is a Lattice Semiconductor ECP2 family field programmable gate array (FPGA) supplied in a 672-ball BGA package. It provides a balance of programmable logic capacity, embedded memory, and high I/O density for designs that require flexible, reconfigurable logic in a compact surface-mount package.

With 2,625 CLBs (approximately 21,000 logic elements), roughly 282,624 bits of on-chip RAM, and up to 402 I/O, this device targets applications that need moderate logic density combined with substantial I/O and embedded memory while operating from a low-voltage core supply.

Key Features

• Logic Resources — 2,625 CLBs and 21,000 logic elements provide programmable logic capacity for implementing custom datapaths, state machines, and glue logic.
• Embedded Memory — Total on-chip RAM of 282,624 bits (approximately 0.283 Mbits) for buffering, FIFOs, and small data storage needs without external memory.
• I/O Density — Up to 402 I/O pins to support multiple interfaces, parallel buses, and mixed-signal I/O routing in complex designs.
• Package and Mounting — 672-BBGA supplier package (672-FPBGA, 27×27) in a surface-mount form factor to enable high pin-count routing in compact board layouts.
• Power — Core voltage supply range of 1.14 V to 1.26 V for compatibility with low-voltage power domains.
• Operating Conditions — Commercial-grade device specified for 0 °C to 85 °C operation.
• Compliance — RoHS-compliant manufacturing status for environmental and regulatory considerations.

Typical Applications

• High-density I/O Interfaces — Use the 402 I/O pins to implement complex interface bridging, parallel buses, and multi-signal gateways.
• Embedded Control and Glue Logic — Leverage the 2,625 CLBs and 21,000 logic elements to implement custom control, sequencing, and protocol handlers.
• Data Buffering and Small Memory Functions — On-chip RAM (≈0.283 Mbits) supports FIFO buffering, small lookup tables, and temporary storage without external RAM.
• Compact Board Designs — The 672-BBGA package enables high pin count in a compact footprint for space-constrained PCBs.

Unique Advantages

• Substantial I/O Capacity: 402 I/O pins enable interfacing to many peripherals and parallel signals without external multiplexing.
• Balanced Logic Density: 2,625 CLBs and 21,000 logic elements provide the resources to implement medium-complexity FPGA designs while maintaining efficient utilization.
• Integrated On-chip Memory: Approximately 0.283 Mbits of embedded RAM reduces dependence on external memory for buffering and small storage tasks.
• Low-voltage Core: Core supply range of 1.14 V to 1.26 V supports integration with modern low-voltage power domains.
• Compact, High-pin-count Package: 672-BBGA (672-FPBGA, 27×27) offers a high-density pinout in a board-friendly surface-mount form factor.
• Commercial Grade and RoHS Compliant: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial designs.

Why Choose LFE2-20E-6F672C?

The LFE2-20E-6F672C delivers a practical combination of programmable logic, embedded RAM, and high I/O count in a compact 672-BBGA package. It is positioned for designers who need moderate logic capacity with ample I/O and on-chip memory while operating in commercial temperature ranges.

This device suits teams building embedded controllers, interface bridges, and compact systems where board space and I/O density matter. Its electrical and packaging specifications support scalability within the ECP2 family and integration into production designs that prioritize a balance of performance, integration, and manufacturability.

Request a quote or submit an inquiry to get pricing and availability for the LFE2-20E-6F672C and discuss how it fits your next FPGA design.