LFE2-20E-6F256C

The LFE2-20E-6F256C is an ECP2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation configured in a 256-ball BGA package. It provides a mid-range programmable logic device intended for commercial embedded applications that require configurable logic, on-chip RAM, and a substantial number of I/O pins.

This device integrates 21,000 logic elements, 282,624 bits of on-chip RAM, and 193 I/O pins in a 256-FPBGA (17×17) surface-mount package, operating from a 1.14 V to 1.26 V supply and specified for 0 °C to 85 °C ambient temperature.

Key Features

• Logic Capacity 21,000 logic elements provide programmable fabric for custom logic, control functions, and glue-logic integration.
• On-Chip Memory Total embedded RAM of 282,624 bits (approximately 0.283 Mbits) to support buffering, small lookup tables, and state storage.
• I/O Density 193 user I/O pins to support multiple interfaces, peripherals, and board-level signal routing.
• Package 256-BGA (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact, board-level integration.
• Power Core supply voltage range of 1.14 V to 1.26 V for the FPGA core domain.
• Commercial Grade & Environment Commercial operating temperature range of 0 °C to 85 °C and RoHS-compliant materials.

Typical Applications

• Embedded System Control Implement custom state machines, peripheral interfacing, and control logic in compact embedded designs.
• Interface Bridging Bridge or adapt multiple digital interfaces using the device’s logic capacity and abundant I/O resources.
• Prototyping and Development Evaluate and iterate hardware-accelerated functions or custom logic before committing to ASIC or larger FPGA solutions.

Unique Advantages

• Substantial Logic Resource: 21,000 logic elements allow integration of complex glue logic and control functions without external ASICs.
• Embedded Memory Capacity: 282,624 bits of on-chip RAM provide local storage for buffering and small data structures, reducing external memory needs.
• High I/O Count: 193 I/O pins enable connection to multiple peripherals and interfaces directly from the FPGA.
• Compact BGA Footprint: 256-FPBGA (17×17) package supports high-density board layouts while remaining surface-mount compatible.
• Commercial Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial product lifecycles.

Why Choose LFE2-20E-6F256C?

The LFE2-20E-6F256C positions itself as a mid-range ECP2 FPGA suitable for designers who need a balance of programmable logic, embedded memory, and flexible I/O in a compact BGA package. Its 21,000 logic elements, substantial on-chip RAM, and 193 I/Os make it appropriate for embedded control, interface adaptation, and prototyping tasks where commercial-grade operation and RoHS compliance are required.

Backed by Lattice Semiconductor Corporation manufacturing, this device is intended for teams seeking a scalable FPGA option for commercial applications that require surface-mount packaging and defined voltage and temperature operating windows.

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