LFE2-6SE-6F256I

The LFE2-6SE-6F256I is an ECP2 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for industrial applications. It provides on-chip resources including logic cells, CLBs and embedded RAM to implement glue logic, interface bridging and control functions in space-constrained surface-mount designs.

Key hardware attributes include 190 I/O pins, 56,320 bits of total RAM, a compact 256-ball BGA package, an industrial temperature rating, and a low-voltage core supply range. These characteristics make the device suitable where predictable I/O density and environmental range are required.

Key Features

• Core Logic — 750 CLBs and 6,000 logic elements available for implementing custom digital logic, state machines and glue logic.
• Embedded Memory — 56,320 bits of on-chip RAM for FIFOs, small buffers and local storage requirements.
• I/O Density — 190 user I/O pins to support multiple downstream interfaces, signal routing and peripheral connections.
• Power — Core supply voltage range of 1.14 V to 1.26 V to match system power-rail designs that use low-voltage FPGA cores.
• Package & Mounting — 256-ball F-PBGA (17 × 17 mm) surface-mount package offering a compact footprint for PCB space-constrained applications.
• Temperature & Grade — Industrial grade with operating temperature range from −40 °C to 100 °C for use in harsher ambient environments.
• Compliance — RoHS-compliant manufacture to meet environmental and assembly requirements.

Typical Applications

• Industrial Control — Implement control logic, protocol conversion and I/O aggregation using the device’s industrial temperature rating and 190 I/O pins.
• Communications Interfaces — Bridge and adapt multiple peripheral interfaces with the available logic elements and embedded RAM for buffering.
• Sensor and Actuator Interfacing — Aggregate signals from sensors and drive actuators while meeting industrial temperature and mounting requirements.
• Embedded Glue Logic — Replace discrete logic with programmable fabric to reduce BOM and consolidate interface functions on a single 256-BGA device.

Unique Advantages

• Balanced Logic and Memory: Combines 6,000 logic elements with 56,320 bits of RAM to handle both combinational logic and local buffering needs on-chip.
• High I/O Count: 190 I/O pins provide flexibility to connect multiple external devices without additional I/O expanders.
• Compact Surface-Mount Package: The 256-FPBGA (17 × 17 mm) package enables high integration in space-constrained PCBs.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployment in industrial environments.
• Low-Voltage Core Compatibility: Core supply range of 1.14–1.26 V to align with modern low-voltage power-rail designs.
• RoHS-Compliant Manufacturing: Meets common environmental and assembly requirements for modern electronics production.

Why Choose LFE2-6SE-6F256I?

The LFE2-6SE-6F256I positions itself as a compact, industrial-grade FPGA option that balances logic capacity, embedded RAM and a high I/O count in a 256-ball BGA footprint. It is well suited for engineers who need on-board programmable logic for interface handling, protocol bridging and control functions while operating across a wide temperature range.

Designed and manufactured by Lattice Semiconductor Corporation, this device provides predictable hardware resources and form-factor advantages for mid-density FPGA designs where integration, I/O flexibility and industrial temperature performance are primary considerations.

Request a quote or submit a pricing inquiry for the LFE2-6SE-6F256I to get availability and lead-time information tailored to your project requirements.