LFE2-6SE-6FN256C

The LFE2-6SE-6FN256C is an ECP2 family Field Programmable Gate Array from Lattice Semiconductor Corporation. It integrates 6,000 logic elements and provides 190 user I/O pins along with on-chip RAM to support compact, configurable digital designs.

Engineered for commercial-grade applications, this device offers a low-voltage core supply range and a 256-ball BGA package for high-density board integration.

Key Features

• Core Logic  Approximately 6,000 logic elements to implement combinational and sequential digital logic functions.
• Embedded Memory  Approximately 56,320 bits of on-chip RAM to support local buffering, FIFOs, and small data stores.
• I/O Density  190 user I/O pins provide flexible interfacing options for peripherals, buses, and I/O expansion.
• Power  Core supply voltage range from 1.14 V to 1.26 V to match low-voltage system domains.
• Package  256-BGA package (256-FPBGA, 17 × 17 mm) for high pin count in a compact footprint.
• Operating Range  Commercial-grade operating temperature from 0 °C to 85 °C.
• Mounting  Surface-mount device suited for modern PCB assembly.
• Environmental  RoHS compliant.

Typical Applications

• Custom digital logic and prototyping  Implement user-defined state machines, control logic, and glue logic using the device’s 6,000 logic elements and on-chip RAM.
• High-density I/O interfacing  Leverage 190 I/O pins for bridging between multiple peripherals, sensors, or expansion connectors in compact systems.
• Embedded system integration  Use the low-voltage core and compact 256-BGA package for space-constrained commercial designs that require moderate logic and memory resources.

Unique Advantages

• Balanced logic and memory capacity: The combination of roughly 6,000 logic elements and 56,320 bits of RAM supports a wide range of mid-density FPGA designs without external memory for small data structures.
• High I/O count: 190 I/O pins enable complex interfacing and multi-channel connectivity while minimizing the need for external I/O expanders.
• Compact BGA footprint: The 256-FPBGA (17 × 17 mm) package delivers high pin density in a relatively small board area, aiding compact system layouts.
• Low-voltage operation: The 1.14 V to 1.26 V supply range aligns with modern low-voltage system domains for power-conscious designs.
• Commercial-grade suitability: Specified for 0 °C to 85 °C operation, appropriate for a wide range of commercial applications.
• RoHS compliant: Environmentally compliant manufacturing and materials.

Why Choose LFE2-6SE-6FN256C?

The LFE2-6SE-6FN256C is positioned for designers needing a mid-density FPGA with substantial I/O capability and on-chip RAM in a compact BGA package. Its combination of approximately 6,000 logic elements, 190 I/Os, and a 256-FPBGA footprint makes it suitable for commercial products that require configurable digital logic and moderate embedded memory.

Backed by Lattice Semiconductor Corporation, this device offers a clear specification set for teams looking to balance integration density, low-voltage operation, and board-space efficiency while maintaining RoHS compliance.

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