LFE2-6SE-6F256C

The LFE2-6SE-6F256C is an ECP2 family field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation, supplied in a 256-ball BGA package. It provides a commercial-grade, mid-density FPGA architecture suited for designs that require a balance of logic density, on-chip memory, and a high I/O count.

Key hardware characteristics include 6,000 logic elements, 56,320 bits of on-chip RAM, and 190 available I/O signals, operating across a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C commercial temperature window.

Key Features

• Core / Logic — 6,000 logic elements provide mid-range programmable logic capacity for custom digital functions.
• Embedded Memory — Total on-chip RAM of 56,320 bits for storage and buffering within user logic.
• I/O Capacity — 190 I/O pins support connections to multiple peripherals and parallel interfaces.
• Power — Operates from a 1.14 V to 1.26 V supply, enabling low-voltage system integration.
• Package and Mounting — Supplied in a 256-BGA (supplier package: 256-FPBGA 17×17) surface-mount package to support compact, high-density board designs.
• Temperature and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• Embedded control — Use the FPGA’s 6,000 logic elements and on-chip RAM for control and glue-logic tasks in commercial equipment.
• I/O bridging and interface aggregation — 190 I/O pins enable connecting multiple sensors, peripherals, or parallel interfaces in a compact design.
• Custom signal processing — On-chip RAM combined with programmable logic supports tailored processing pipelines and buffering for application-specific data paths.

Unique Advantages

• Balanced logic and memory capacity: 6,000 logic elements paired with 56,320 bits of RAM to implement moderate-complexity designs without external memory in many cases.
• High I/O count: 190 I/Os simplify integration with multiple peripherals and subsystems, reducing the need for external multiplexing.
• Compact, high-density package: 256-BGA (256-FPBGA 17×17) surface-mount package enables a small PCB footprint while maintaining a large pin count.
• Low-voltage operation: 1.14 V to 1.26 V supply range supports integration into low-voltage systems.
• Commercial temperature suitability: Specified for 0 °C to 85 °C operation for a wide range of commercial applications.
• RoHS compliant: Aligns with lead-free manufacturing and environmental requirements.

Why Choose LFE2-6SE-6F256C?

The LFE2-6SE-6F256C delivers a practical combination of programmable logic, embedded memory, and a high I/O count in a compact BGA package for commercial-grade designs. Its specification set—6,000 logic elements, 56,320 bits of on-chip RAM, 190 I/Os, and low-voltage operation—makes it well suited to embedded control, interface aggregation, and custom processing tasks where board space and I/O density matter.

Engineers and procurement teams targeting mid-density FPGA solutions for commercial equipment will find this device a straightforward option for reducing external components while maintaining design flexibility and a compact footprint.

Request a quote or submit a purchasing inquiry to obtain pricing and availability for the LFE2-6SE-6F256C. Our team can provide lead-time and ordering information to support your design schedule.