LFE2-6SE-6FN256I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 190 56320 6000 256-BGA |
|---|---|
| Quantity | 352 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 190 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 750 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 56320 |
Overview of LFE2-6SE-6FN256I – ECP2 FPGA, 256‑BGA, Industrial Grade
The LFE2-6SE-6FN256I is an ECP2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It integrates approximately 6,000 logic elements and 56,320 bits of on-chip RAM in a 256-ball BGA package.
Graded for industrial use, the device is specified for operation from -40 °C to 100 °C and operates with a core supply range of 1.14 V to 1.26 V. The package supports surface-mount assembly and exposes 190 user I/O connections.
Key Features
- Core Logic Approximately 6,000 logic elements organized into 750 logic blocks, providing moderate logic density for custom logic implementations.
- Embedded Memory 56,320 bits of on-chip RAM for local data buffering and small embedded storage needs.
- I/O 190 user I/O pins to support a wide range of external interfaces and peripherals.
- Power Core voltage supply range of 1.14 V to 1.26 V to match low-voltage system domains.
- Package & Mounting 256-BGA package (supplier package: 256-FPBGA, 17×17) with surface-mount mounting type for compact PCB implementations.
- Temperature & Grade Industrial grade device rated for operation from -40 °C to 100 °C.
- Environmental RoHS compliant.
Unique Advantages
- Compact, high-density package: The 256-FPBGA (17×17) package enables a compact board footprint while providing numerous I/O connections.
- Balanced logic and memory: Approximately 6,000 logic elements combined with 56,320 bits of on-chip RAM reduce reliance on external logic and small external memories.
- High I/O count: 190 available I/O pins support multiple interface requirements without immediate need for I/O expanders.
- Industrial temperature rating: Specified operation from -40 °C to 100 °C addresses extended environmental requirements for industrial deployments.
- Low-voltage core compatibility: Core supply range of 1.14 V to 1.26 V is compatible with modern low-voltage system domains.
Why Choose LFE2-6SE-6FN256I?
The LFE2-6SE-6FN256I combines a moderate logic element count, on-chip RAM, and a high I/O count in an industrial-grade 256-BGA surface-mount package. Its specified operating temperature range and low-voltage core make it a straightforward choice when those exact electrical and environmental parameters are required.
Engineers and procurement teams looking for an industrial-grade ECP2 FPGA with defined logic capacity, embedded memory, and a compact BGA footprint will find this part aligned with those needs.
If you would like pricing or availability, submit a quote request or contact sales to request a quote for the LFE2-6SE-6FN256I.
Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016
