LFE2-6SE-7F256C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 190 56320 6000 256-BGA |
|---|---|
| Quantity | 397 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 190 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 750 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 56320 |
Overview of LFE2-6SE-7F256C – ECP2 Field Programmable Gate Array (FPGA) IC, 256-BGA
The LFE2-6SE-7F256C is a commercial-grade Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation in the ECP2 family. It provides a medium-density programmable logic fabric with 6,000 logic elements and approximately 56,320 bits of on-chip RAM, delivered in a 256-ball BGA package (256-FPBGA, 17×17).
This device is optimized for commercial electronic designs that require flexible digital logic, moderate embedded memory, and substantial I/O connectivity. The part operates from a core supply range of 1.14 V to 1.26 V and supports an operating temperature range of 0 °C to 85 °C.
Key Features
- Logic Capacity: 6,000 logic elements to implement custom digital functions and state machines for moderate-scale designs.
- Embedded Memory: 56,320 bits of on-chip RAM, providing local storage for buffering, FIFOs, and small data tables.
- I/O Resources: 190 I/O pins to support a broad range of peripheral interfaces and system interconnects.
- Core Power: Low-voltage core operation with a supply range of 1.14 V to 1.26 V for compatibility with modern low-voltage system rails.
- Package & Mounting: 256-ball FPBGA (17×17) package in a surface-mount form factor for compact board integration.
- Commercial Temperature Grade: Rated for operation from 0 °C to 85 °C, suitable for commercial electronic environments.
- RoHS Compliant: Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.
Typical Applications
- Commercial Embedded Systems: Use the device’s 6,000 logic elements and 190 I/O to implement custom control, glue logic, and interface functions in commercial products.
- Prototyping and Development: Medium-density programmable resources and on-chip RAM support evaluation and proof-of-concept designs.
- Interface Bridging and I/O Expansion: High I/O count enables bridging between buses and expanding peripheral connectivity on compact PCBs.
- Custom Digital Acceleration: Deploy the FPGA fabric and embedded RAM to accelerate application-specific digital processing in commercial equipment.
Unique Advantages
- Balanced Logic Density: 6,000 logic elements provide a compromise between capability and cost for moderate-complexity designs.
- Substantial I/O Capacity: 190 I/O pins simplify system integration by reducing the need for external I/O expanders.
- Compact BGA Package: 256-FPBGA (17×17) enables high-density board layouts while supporting surface-mount assembly.
- Low-Voltage Core: 1.14 V–1.26 V supply supports integration into modern low-voltage architectures and can help reduce system power consumption.
- Commercial Temperature Range: Specified 0 °C to 85 °C operation suits a wide range of commercial applications without the added cost of higher-grade qualification.
- Environmental Compliance: RoHS-compliant construction simplifies regulatory compliance for product manufacturing.
Why Choose LFE2-6SE-7F256C?
The LFE2-6SE-7F256C positions itself as a practical, commercial-grade FPGA solution for design teams needing moderate logic capacity, ample I/O, and on-chip RAM in a compact BGA package. Its combination of 6,000 logic elements, roughly 56 kb of embedded memory, and 190 I/O pins offers designers the flexibility to implement custom logic, interface functions, and data buffering without a large form factor.
Backed by Lattice Semiconductor Corporation, this ECP2-series device is suitable for commercial product designs where predictable thermal and voltage characteristics matter. It delivers a clear trade-off of integration and footprint for teams focused on scalable, manufacturable digital designs.
Request a quote or submit an inquiry to obtain pricing and availability for the LFE2-6SE-7F256C.