LFE2-6SE-7F256C

IC FPGA 190 I/O 256FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 190 56320 6000 256-BGA

Quantity 397 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O190Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs750Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits56320

Overview of LFE2-6SE-7F256C – ECP2 Field Programmable Gate Array (FPGA) IC, 256-BGA

The LFE2-6SE-7F256C is a commercial-grade Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation in the ECP2 family. It provides a medium-density programmable logic fabric with 6,000 logic elements and approximately 56,320 bits of on-chip RAM, delivered in a 256-ball BGA package (256-FPBGA, 17×17).

This device is optimized for commercial electronic designs that require flexible digital logic, moderate embedded memory, and substantial I/O connectivity. The part operates from a core supply range of 1.14 V to 1.26 V and supports an operating temperature range of 0 °C to 85 °C.

Key Features

  • Logic Capacity: 6,000 logic elements to implement custom digital functions and state machines for moderate-scale designs.
  • Embedded Memory: 56,320 bits of on-chip RAM, providing local storage for buffering, FIFOs, and small data tables.
  • I/O Resources: 190 I/O pins to support a broad range of peripheral interfaces and system interconnects.
  • Core Power: Low-voltage core operation with a supply range of 1.14 V to 1.26 V for compatibility with modern low-voltage system rails.
  • Package & Mounting: 256-ball FPBGA (17×17) package in a surface-mount form factor for compact board integration.
  • Commercial Temperature Grade: Rated for operation from 0 °C to 85 °C, suitable for commercial electronic environments.
  • RoHS Compliant: Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

  • Commercial Embedded Systems: Use the device’s 6,000 logic elements and 190 I/O to implement custom control, glue logic, and interface functions in commercial products.
  • Prototyping and Development: Medium-density programmable resources and on-chip RAM support evaluation and proof-of-concept designs.
  • Interface Bridging and I/O Expansion: High I/O count enables bridging between buses and expanding peripheral connectivity on compact PCBs.
  • Custom Digital Acceleration: Deploy the FPGA fabric and embedded RAM to accelerate application-specific digital processing in commercial equipment.

Unique Advantages

  • Balanced Logic Density: 6,000 logic elements provide a compromise between capability and cost for moderate-complexity designs.
  • Substantial I/O Capacity: 190 I/O pins simplify system integration by reducing the need for external I/O expanders.
  • Compact BGA Package: 256-FPBGA (17×17) enables high-density board layouts while supporting surface-mount assembly.
  • Low-Voltage Core: 1.14 V–1.26 V supply supports integration into modern low-voltage architectures and can help reduce system power consumption.
  • Commercial Temperature Range: Specified 0 °C to 85 °C operation suits a wide range of commercial applications without the added cost of higher-grade qualification.
  • Environmental Compliance: RoHS-compliant construction simplifies regulatory compliance for product manufacturing.

Why Choose LFE2-6SE-7F256C?

The LFE2-6SE-7F256C positions itself as a practical, commercial-grade FPGA solution for design teams needing moderate logic capacity, ample I/O, and on-chip RAM in a compact BGA package. Its combination of 6,000 logic elements, roughly 56 kb of embedded memory, and 190 I/O pins offers designers the flexibility to implement custom logic, interface functions, and data buffering without a large form factor.

Backed by Lattice Semiconductor Corporation, this ECP2-series device is suitable for commercial product designs where predictable thermal and voltage characteristics matter. It delivers a clear trade-off of integration and footprint for teams focused on scalable, manufacturable digital designs.

Request a quote or submit an inquiry to obtain pricing and availability for the LFE2-6SE-7F256C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up