LFE2-6SE-7FN256C

IC FPGA 190 I/O 256FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 190 56320 6000 256-BGA

Quantity 208 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O190Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs750Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits56320

Overview of LFE2-6SE-7FN256C – ECP2 Field Programmable Gate Array (FPGA) IC 190 56320 6000 256-BGA

The LFE2-6SE-7FN256C is an ECP2 family field programmable gate array (FPGA) provided in a 256-BGA package. It offers reprogrammable logic with 6,000 logic elements, embedded on-chip memory, and a high I/O count to support complex digital designs.

Designed as a commercial-grade, surface-mount device, this FPGA operates from a 1.14 V to 1.26 V supply and is specified for an ambient operating range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

  • Core Logic  6,000 logic elements provide the programmable fabric for implementing custom digital functions and control logic.
  • Embedded Memory  Approximately 56 Kbits (56,320 bits) of on-chip RAM for buffering, state storage, and small lookup tables.
  • High I/O Count  190 programmable I/O pins to support broad interfacing needs across peripherals and system buses.
  • Package  256-ball FBGA (256-FPBGA) package, 17 × 17 mm footprint, suitable for compact board layouts and high-density designs.
  • Power  Operates from a 1.14 V to 1.26 V supply range to match common FPGA power rails and system power architectures.
  • Mounting and Grade  Surface mount device, commercial grade, intended for standard commercial electronic applications.
  • Temperature Range  Specified for operation from 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant for lead-free manufacturing and environmental regulatory alignment.

Unique Advantages

  • Balanced logic and memory capacity: 6,000 logic elements paired with approximately 56 Kbits of embedded RAM provide a compact mix of resources for mid-range programmable tasks.
  • High pin count for flexible interfacing: 190 I/O pins enable multiple parallel interfaces or extensive peripheral connectivity without external expansion.
  • Compact BGA package: The 256-FPBGA (17×17) delivers a space-efficient form factor for densely populated PCBs.
  • Commercial-grade thermal range: Rated for 0 °C to 85 °C operation to suit standard commercial environments.
  • RoHS compliant: Facilitates integration into lead-free manufacturing flows and helps meet regulatory requirements.
  • Surface-mount compatibility: Standard SMT mounting simplifies assembly within common manufacturing processes.

Why Choose LFE2-6SE-7FN256C?

The LFE2-6SE-7FN256C delivers a balanced FPGA solution for designs that need a mid-range amount of programmable logic, embedded RAM, and a high number of I/O in a compact BGA package. Its defined voltage supply range and commercial operating temperature make it suitable for mainstream electronic products and embedded systems where proven, reprogrammable logic is required.

Choose this part when you need a RoHS-compliant, surface-mount FPGA with 6,000 logic elements, approximately 56 Kbits of on-chip RAM, and 190 I/Os in a 256-FPBGA (17×17) package—providing reliable integration and predictable electrical and thermal characteristics for commercial applications.

Request a quote or submit an inquiry to receive pricing and availability for the LFE2-6SE-7FN256C.

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