LFE2-70E-5F672C

The LFE2-70E-5F672C is an ECP2 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, delivered in a 672-BBGA surface-mount package. It provides a high level of on-chip integration with 68,000 logic elements, approximately 1.06 Mbits of embedded RAM, and up to 500 I/O pins.

Designed for commercial-grade applications, this device operates from a low-voltage supply (1.14 V to 1.26 V) and within an operating temperature range of 0 °C to 85 °C. It is RoHS compliant and available in a 672-FPBGA (27×27) supplier package.

Key Features

• Core / Logic 68,000 logic elements provide substantial programmable logic capacity for medium- to high-complexity digital designs.
• Embedded Memory Approximately 1.06 Mbits of on-chip RAM to implement FIFOs, buffers, and other memory-centric blocks without external memory.
• I/O Density Up to 500 I/O pins enable extensive interfacing to peripherals, sensors, and other system components.
• Power Low-voltage operation from 1.14 V to 1.26 V supports power-conscious designs and modern system voltage domains.
• Package & Mounting 672-BBGA package (supplier device package: 672-FPBGA, 27×27) in a surface-mount form factor for high pin-count board layouts.
• Temperature & Grade Commercial grade operation with specified temperature range of 0 °C to 85 °C.
• Compliance RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Custom Logic and Prototyping Implement and validate complex digital functions using the device’s 68,000 logic elements and embedded RAM.
• High‑Density I/O Control Manage many parallel interfaces or multiplexed peripherals leveraging up to 500 I/O pins.
• Memory‑Minded Functions Use approximately 1.06 Mbits of on-chip RAM for buffering, packet processing, or on-chip data storage to reduce external memory needs.
• Low‑Voltage System Integration Integrate into modern low-voltage designs with a supply range of 1.14 V to 1.26 V.

Unique Advantages

• High Logic Density: 68,000 logic elements enable implementation of complex custom logic without immediate need for larger devices.
• Substantial On‑Chip Memory: Approximately 1.06 Mbits of embedded RAM reduces dependence on external memory for many designs.
• Extensive I/O Count: Up to 500 I/Os simplify board-level routing and peripheral connectivity for feature-rich designs.
• Compact High‑Pin‑Count Package: 672-BBGA / 672-FPBGA (27×27) package delivers high pin density in a standard surface-mount footprint.
• Commercial Temperature Range: Specified for 0 °C to 85 °C operation, matching common commercial design requirements.
• Environmental Compliance: RoHS compliance supports regulatory and environmental objectives.

Why Choose LFE2-70E-5F672C?

The LFE2-70E-5F672C positions itself as a highly integrated commercial-grade FPGA option from Lattice Semiconductor Corporation, combining significant logic capacity, embedded memory, and a large I/O count in a compact 672-BBGA package. Its low-voltage supply and RoHS compliance make it suitable for modern, power-conscious designs that require dense programmable logic and on-chip memory.

This device is well suited to engineering teams and procurement groups looking for a scalable, compact FPGA solution that balances logic resources, memory, and I/O in a surface-mount form factor backed by an established manufacturer.

Request a quote or submit an inquiry to receive pricing and availability for the LFE2-70E-5F672C. Our team can provide ordering information and assist with integration details based on your design requirements.