LFE2-70E-5F900I

The LFE2-70E-5F900I is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for applications requiring high logic density and large I/O counts. It integrates 68,000 logic elements and approximately 1.06 Mbits of embedded memory to support complex glue logic, protocol bridging, and system integration tasks.

Built for surface-mount assembly in a 900-BBGA / 900-FPBGA (31×31) package and rated for industrial operation, this device delivers a balanced combination of logic capacity, on-chip RAM, and I/O capability within a compact package footprint.

Key Features

• Core Logic 
  68,000 logic elements and 8,500 LABs provide substantial resources for combinational and sequential logic implementation.
• Embedded Memory 
  Approximately 1.06 Mbits (1,056,768 bits) of on-chip RAM to support buffering, FIFOs, and small lookup tables without external memory.
• I/O Capacity 
  Up to 583 I/O pins to accommodate high-pin-count interfaces and reduce the need for external I/O expanders.
• Power 
  Operates from a core voltage supply range of 1.14 V to 1.26 V, suitable for systems designed around modern core supply rails.
• Package & Mounting 
  900-BBGA package case with supplier device package 900-FPBGA (31×31); surface-mount mounting for compact PCB integration.
• Temperature & Grade 
  Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in harsher environments.
• Compliance 
  RoHS compliant, meeting common environmental manufacturing requirements.

Typical Applications

• I/O-Intensive Systems 
  Use where large numbers of external interfaces are required, leveraging 583 available I/O pins to consolidate functions on a single FPGA.
• Logic-Heavy Integration 
  High-density logic (68,000 elements) supports integration of complex glue logic, custom state machines, and protocol translators.
• Industrial Control 
  Industrial-grade temperature rating and robust on-chip resources make it suitable for industrial control and automation subsystems.

Unique Advantages

• High integration density: 68,000 logic elements and 8,500 LABs reduce the need for multiple discrete components, simplifying board-level design.
• Substantial on-chip memory: Approximately 1.06 Mbits of embedded RAM enables internal buffering and data handling without immediate external memory.
• Extensive I/O support: 583 I/O pins allow consolidation of multiple interfaces and peripheral connections onto a single device.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in demanding thermal environments.
• Compact BGA footprint: 900-BBGA / 900-FPBGA (31×31) package offers a high-pin-count solution in a compact, surface-mount form factor.
• RoHS compliant: Meets environmental compliance expectations for modern electronics manufacturing.

Why Choose LFE2-70E-5F900I?

The LFE2-70E-5F900I positions itself as a high-density, industrial-grade FPGA option for designs that require substantial logic resources, on-chip memory, and a large number of I/Os in a compact BGA package. It is well suited to teams seeking to consolidate complex logic and multiple interfaces onto a single programmable device while meeting industrial temperature requirements.

Backed by Lattice Semiconductor Corporation, this device provides a balance of capacity, I/O scalability, and environmental compliance that supports long-term deployment and integration into established design flows.

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