LFE2-70E-5FN900I

The LFE2-70E-5FN900I is an ECP2 family Field Programmable Gate Array (FPGA) IC designed for industrial embedded applications. It delivers a combination of high logic capacity, on-chip memory, and a large I/O count for dense system integration and flexible hardware acceleration.

Key device characteristics include 68,000 logic elements, approximately 1.06 Mbits of embedded memory, up to 583 I/Os, a compact 900‑BBGA surface-mount package, and an industrial operating temperature range.

Key Features

• Core Logic 68,000 logic elements provide significant programmable fabric for implementing complex digital functions and custom accelerators.
• Embedded Memory Approximately 1.06 Mbits of on-chip RAM (1,056,768 bits) for buffering, state machines, and small data stores.
• I/O Density 583 available I/Os support extensive peripheral interfacing and high channel counts for system-level connectivity.
• Power Supply Operates from a supply range of 1.14 V to 1.26 V, enabling low-voltage core operation.
• Package & Mounting 900‑BBGA package (supplier device package: 900‑FPBGA, 31×31) in a surface-mount form factor for compact board-level integration.
• Industrial Temperature & Grade Rated for operation from −40 °C to 100 °C and specified as industrial grade for deployment in demanding environments.
• Environmental Compliance RoHS compliant.

Typical Applications

• Industrial Control Implement real-time control logic, I/O aggregation, and protocol bridging in industrial automation and control systems.
• Communications & Networking Use the high I/O count and programmable fabric to implement interface logic, custom packet processing, and board-level protocol support.
• Instrumentation & Test Leverage on-chip memory and dense logic to perform data acquisition, signal conditioning logic, and custom measurement functions.

Unique Advantages

• Significant Logic Capacity: 68,000 logic elements support complex designs and multiple functional blocks on a single FPGA, reducing external component count.
• On‑Chip Memory for Local Storage: Approximately 1.06 Mbits of embedded RAM enables efficient buffering and state retention without adding external memory.
• High Pin Count for Dense I/O: 583 I/Os provide flexibility for multi‑channel interfaces, sensor arrays, and board-level integration.
• Industrial-Grade Reliability: −40 °C to 100 °C operating range and industrial grade designation support deployment in temperature-challenging environments.
• Compact, Board-Friendly Package: 900‑BBGA (31×31) surface-mount package helps save PCB area while accommodating high-density routing.

Why Choose LFE2-70E-5FN900I?

The LFE2-70E-5FN900I combines substantial logic resources, embedded memory, and a very high I/O count in a compact industrial-grade package, making it well suited for engineers designing complex embedded systems that require on-board programmability and dense interfacing. Its voltage and temperature specifications align with industrial deployment needs, offering a reliable building block for control, communication, and instrumentation designs.

For projects that demand scalability and integration—reducing BOM and consolidating discrete functions into programmable logic—this FPGA provides a balanced mix of capacity, I/O density, and environmental robustness.

Request a quote or submit a procurement inquiry to get pricing and availability for LFE2-70E-5FN900I.